|
W24258Q-70LI |
W24258-70LI |
W24258H |
W24258 |
W24258-70LE |
W24258Q-70LE |
W24258S-70LE |
W24258S-70LI |
Description |
32k X 8 cmos static ram |
32k X 8 cmos static ram |
32k X 8 cmos static ram |
32k X 8 cmos static ram |
32k X 8 cmos static ram |
32k X 8 cmos static ram |
32k X 8 cmos static ram |
32k X 8 cmos static ram |
Is it Rohs certified? |
incompatible |
incompatible |
- |
- |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
- |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
Parts packaging code |
TSOP |
DIP |
DIE |
- |
DIP |
TSOP |
SOIC |
SOIC |
package instruction |
8 X 13.40 MM, TSOP1-28 |
0.600 INCH, PLASTIC, DIP-28 |
DIE, |
- |
0.600 INCH, PLASTIC, DIP-28 |
8 X 13.40 MM, TSOP1-28 |
0.330 INCH, SOP-28 |
0.330 INCH, SOP-28 |
Contacts |
28 |
28 |
28 |
- |
28 |
28 |
28 |
28 |
Reach Compliance Code |
_compli |
_compli |
unknow |
- |
_compli |
_compli |
_compli |
_compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum access time |
100 ns |
100 ns |
100 ns |
- |
100 ns |
100 ns |
100 ns |
100 ns |
I/O type |
COMMON |
COMMON |
- |
- |
COMMON |
COMMON |
COMMON |
COMMON |
JESD-30 code |
R-PDSO-G28 |
R-PDIP-T28 |
R-XUUC-N28 |
- |
R-PDIP-T28 |
R-PDSO-G28 |
R-PDSO-G28 |
R-PDSO-G28 |
JESD-609 code |
e0 |
e0 |
- |
- |
e0 |
e0 |
e0 |
e0 |
length |
11.8 mm |
37.08 mm |
- |
- |
37.08 mm |
11.8 mm |
18.11 mm |
18.11 mm |
memory density |
262144 bi |
262144 bi |
262144 bi |
- |
262144 bi |
262144 bi |
262144 bi |
262144 bi |
Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
- |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
memory width |
8 |
8 |
8 |
- |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
- |
1 |
1 |
1 |
1 |
Number of terminals |
28 |
28 |
28 |
- |
28 |
28 |
28 |
28 |
word count |
32768 words |
32768 words |
32768 words |
- |
32768 words |
32768 words |
32768 words |
32768 words |
character code |
32000 |
32000 |
32000 |
- |
32000 |
32000 |
32000 |
32000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
- |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
70 °C |
- |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
- |
- |
-20 °C |
-20 °C |
-20 °C |
-40 °C |
organize |
32KX8 |
32KX8 |
32KX8 |
- |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
Output characteristics |
3-STATE |
3-STATE |
- |
- |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSOP1 |
DIP |
DIE |
- |
DIP |
TSOP1 |
SOP |
SOP |
Encapsulate equivalent code |
TSSOP28,.53,22 |
DIP28,.6 |
- |
- |
DIP28,.6 |
TSSOP28,.53,22 |
SOP28,.5 |
SOP28,.5 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE |
IN-LINE |
UNCASED CHIP |
- |
IN-LINE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE |
SMALL OUTLINE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
- |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
NOT SPECIFIED |
240 |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3/5 V |
3/5 V |
- |
- |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
5.33 mm |
- |
- |
5.33 mm |
1.2 mm |
2.85 mm |
2.85 mm |
Maximum standby current |
0.000002 A |
0.000002 A |
- |
- |
- |
0.000002 A |
0.000002 A |
0.000002 A |
Minimum standby current |
2 V |
2 V |
- |
- |
2 V |
2 V |
2 V |
2 V |
Maximum slew rate |
0.07 mA |
0.07 mA |
- |
- |
0.07 mA |
0.07 mA |
0.07 mA |
0.07 mA |
Maximum supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
- |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
- |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
3 V |
- |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
NO |
YES |
- |
NO |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
- |
OTHER |
OTHER |
OTHER |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
THROUGH-HOLE |
NO LEAD |
- |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.55 mm |
2.54 mm |
- |
- |
2.54 mm |
0.55 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
UPPER |
- |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
NOT SPECIFIED |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
width |
8 mm |
15.24 mm |
- |
- |
15.24 mm |
8 mm |
8.41 mm |
8.41 mm |