32k X 8 cmos static ram
W24258 | W24258-70LI | W24258H | W24258Q-70LI | W24258-70LE | W24258Q-70LE | W24258S-70LE | W24258S-70LI | |
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Description | 32k X 8 cmos static ram | 32k X 8 cmos static ram | 32k X 8 cmos static ram | 32k X 8 cmos static ram | 32k X 8 cmos static ram | 32k X 8 cmos static ram | 32k X 8 cmos static ram | 32k X 8 cmos static ram |
Is it Rohs certified? | - | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | - | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation |
Parts packaging code | - | DIP | DIE | TSOP | DIP | TSOP | SOIC | SOIC |
package instruction | - | 0.600 INCH, PLASTIC, DIP-28 | DIE, | 8 X 13.40 MM, TSOP1-28 | 0.600 INCH, PLASTIC, DIP-28 | 8 X 13.40 MM, TSOP1-28 | 0.330 INCH, SOP-28 | 0.330 INCH, SOP-28 |
Contacts | - | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | - | _compli | unknow | _compli | _compli | _compli | _compli | _compli |
ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | - | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns |
I/O type | - | COMMON | - | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | - | R-PDIP-T28 | R-XUUC-N28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
JESD-609 code | - | e0 | - | e0 | e0 | e0 | e0 | e0 |
length | - | 37.08 mm | - | 11.8 mm | 37.08 mm | 11.8 mm | 18.11 mm | 18.11 mm |
memory density | - | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi |
Memory IC Type | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | - | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
word count | - | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
character code | - | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | - | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | - | -40 °C | -20 °C | -20 °C | -20 °C | -40 °C |
organize | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
Output characteristics | - | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | DIP | DIE | TSOP1 | DIP | TSOP1 | SOP | SOP |
Encapsulate equivalent code | - | DIP28,.6 | - | TSSOP28,.53,22 | DIP28,.6 | TSSOP28,.53,22 | SOP28,.5 | SOP28,.5 |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | IN-LINE | UNCASED CHIP | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED |
power supply | - | 3/5 V | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | - | 5.33 mm | - | 1.2 mm | 5.33 mm | 1.2 mm | 2.85 mm | 2.85 mm |
Maximum standby current | - | 0.000002 A | - | 0.000002 A | - | 0.000002 A | 0.000002 A | 0.000002 A |
Minimum standby current | - | 2 V | - | 2 V | 2 V | 2 V | 2 V | 2 V |
Maximum slew rate | - | 0.07 mA | - | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA |
Maximum supply voltage (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Minimum supply voltage (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | - | NO | YES | YES | NO | YES | YES | YES |
technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | OTHER | OTHER | OTHER | INDUSTRIAL |
Terminal surface | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | - | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | - | 2.54 mm | - | 0.55 mm | 2.54 mm | 0.55 mm | 1.27 mm | 1.27 mm |
Terminal location | - | DUAL | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
width | - | 15.24 mm | - | 8 mm | 15.24 mm | 8 mm | 8.41 mm | 8.41 mm |