SA620DK,112 datasheet, PDF - EEWORLD Datasheet

SA620DK,112: DescriptionIC lna mixer vco 1ghz 20ssop; CategoryWireless rf/communication Telecom circuit; File Size213KB，15 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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SA620DK,112 Overview

IC lna mixer vco 1ghz 20ssop

Parameter Name	Attribute value
Source Url Status Check Date	2013-06-14 00:00:00
Brand Name	NXP Semiconduc
Maker	NXP
Parts packaging code	SSOP2
package instruction	4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20
Contacts	20
Manufacturer packaging code	SOT266-1
Reach Compliance Code	unknow
JESD-30 code	R-PDSO-G20
JESD-609 code	e4
length	6.5 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.5 mm
Nominal supply voltage	3 V
surface mount	YES
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	4.4 mm

INTEGRATED CIRCUITS

SA620

Low voltage LNA, mixer and VCO – 1GHz

Product data

Supersedes data of 1993 Dec 15

2004 Dec 14

Philips

Semiconductors

	SA620DK,112	SA620DK112	SA620DK,118
Description	IC lna mixer vco 1ghz 20ssop	Up-Down Converters 1 GHZ LV LNA MIXER	IC LNA MIXER VCO 1GHZ 20-SSOP
Source Url Status Check Date	2013-06-14 00:00:00	-	2013-06-14 00:00:00
Brand Name	NXP Semiconduc	-	NXP Semiconductor
Maker	NXP	-	NXP
Parts packaging code	SSOP2	-	SSOP2
package instruction	4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20	-	4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20
Contacts	20	-	20
Manufacturer packaging code	SOT266-1	-	SOT266-1
Reach Compliance Code	unknow	-	unknown
JESD-30 code	R-PDSO-G20	-	R-PDSO-G20
JESD-609 code	e4	-	e4
length	6.5 mm	-	6.5 mm
Humidity sensitivity level	1	-	1
Number of functions	1	-	1
Number of terminals	20	-	20
Maximum operating temperature	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	LSSOP	-	LSSOP
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	-	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	-	260
Certification status	Not Qualified	-	Not Qualified
Maximum seat height	1.5 mm	-	1.5 mm
Nominal supply voltage	3 V	-	3 V
surface mount	YES	-	YES
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT	-	RF AND BASEBAND CIRCUIT
Temperature level	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	-	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm
Terminal location	DUAL	-	DUAL
Maximum time at peak reflow temperature	30	-	30
width	4.4 mm	-	4.4 mm

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