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SA620DK112

Description
Up-Down Converters 1 GHZ LV LNA MIXER
CategoryTopical application    Wireless rf/communication   
File Size213KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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SA620DK112 Overview

Up-Down Converters 1 GHZ LV LNA MIXER

SA620DK112 Parametric

Parameter NameAttribute value
Product CategoryUp-Down Converters
ManufacturerNXP
Gain4.5 dB
Operating Supply Voltage3.3 V, 5 V
Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT
Package / CaseSSOP-20
PackagingTube
Maximum Input Frequency1200 MHz
Minimum Operating Temperature- 40 C
Pd - Power Dissipation980 mW
Factory Pack Quantity75
Unit Weight0.003474 oz
INTEGRATED CIRCUITS
SA620
Low voltage LNA, mixer and VCO – 1GHz
Product data
Supersedes data of 1993 Dec 15
2004 Dec 14
Philips
Semiconductors

SA620DK112 Related Products

SA620DK112 SA620DK,112 SA620DK,118
Description Up-Down Converters 1 GHZ LV LNA MIXER IC lna mixer vco 1ghz 20ssop IC LNA MIXER VCO 1GHZ 20-SSOP
Source Url Status Check Date - 2013-06-14 00:00:00 2013-06-14 00:00:00
Brand Name - NXP Semiconduc NXP Semiconductor
Maker - NXP NXP
Parts packaging code - SSOP2 SSOP2
package instruction - 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20
Contacts - 20 20
Manufacturer packaging code - SOT266-1 SOT266-1
Reach Compliance Code - unknow unknown
JESD-30 code - R-PDSO-G20 R-PDSO-G20
JESD-609 code - e4 e4
length - 6.5 mm 6.5 mm
Humidity sensitivity level - 1 1
Number of functions - 1 1
Number of terminals - 20 20
Maximum operating temperature - 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - LSSOP LSSOP
Package shape - RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - 260 260
Certification status - Not Qualified Not Qualified
Maximum seat height - 1.5 mm 1.5 mm
Nominal supply voltage - 3 V 3 V
surface mount - YES YES
Telecom integrated circuit types - RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT
Temperature level - INDUSTRIAL INDUSTRIAL
Terminal surface - Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form - GULL WING GULL WING
Terminal pitch - 0.65 mm 0.65 mm
Terminal location - DUAL DUAL
Maximum time at peak reflow temperature - 30 30
width - 4.4 mm 4.4 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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