TQFP-100, Reel
Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | TQFP |
package instruction | QFF, QFP100,.63X.87 |
Contacts | 100 |
Manufacturer packaging code | PKG100 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Samacsys Description | TQFP 14.0 X 20.0 X 1.4 MM |
Maximum access time | 5 ns |
Other features | PIPELINED ARCHITECTURE |
Maximum clock frequency (fCLK) | 100 MHz |
I/O type | COMMON |
JESD-30 code | R-PQFP-F100 |
JESD-609 code | e3 |
length | 20 mm |
memory density | 4718592 bit |
Memory IC Type | ZBT SRAM |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 131072 words |
character code | 128000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX36 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFF |
Encapsulate equivalent code | QFP100,.63X.87 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.04 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.25 mA |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) - annealed |
Terminal form | FLAT |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 14 mm |
Base Number Matches | 1 |