SI8251-IM datasheet, PDF - EEWORLD Datasheet

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SI8251-IM: Descriptiongate drivers smps controller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size900KB，32 Pages; ManufacturerSilicon Laboratories Inc; Environmental Compliance

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SI8251-IM Overview

gate drivers smps controller

SI8251-IM Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Silicon Laboratories Inc
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	28
Reach Compliance Code	unknow
JESD-30 code	S-XQCC-N28
length	5 mm
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage	2.75 V
Minimum supply voltage	2.25 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

SI8251-IM Related Products

	SI8251-IM	SI8252-IQ	SI8251-IQ	SI8250-IQ	SI8252-IM	SI8250-IM	MULTIPHSPOL-RD
Description	gate drivers smps controller	gate drivers smps controller	gate drivers smps controller	supervisory circuits smps controller	gate drivers smps controller	supervisory circuits smps controller	KIT REFERENCE DESIGN FOR SI825X
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	-
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	-
Maker	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	-
Parts packaging code	QFN	QFP	QFP	QFP	QFN	QFN	-
package instruction	HVQCCN,	LQFP,	LQFP,	LQFP,	HVQCCN,	HVQCCN,	-
Contacts	28	32	32	32	28	28	-
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	-
JESD-30 code	S-XQCC-N28	S-PQFP-G32	S-PQFP-G32	S-PQFP-G32	S-XQCC-N28	S-XQCC-N28	-
length	5 mm	7 mm	7 mm	7 mm	5 mm	5 mm	-
Number of terminals	28	32	32	32	28	28	-
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	-
encapsulated code	HVQCCN	LQFP	LQFP	LQFP	HVQCCN	HVQCCN	-
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	-
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	1 mm	1.6 mm	1.6 mm	1.6 mm	1 mm	1 mm	-
Maximum supply voltage	2.75 V	2.75 V	2.75 V	2.75 V	2.75 V	2.75 V	-
Minimum supply voltage	2.25 V	2.25 V	2.25 V	2.25 V	2.25 V	2.25 V	-
Nominal supply voltage	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	-
surface mount	YES	YES	YES	YES	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-
Terminal form	NO LEAD	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	-
Terminal pitch	0.5 mm	0.8 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	-
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	5 mm	7 mm	7 mm	7 mm	5 mm	5 mm	-
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	-

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