gate drivers smps controller
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Silicon Laboratories Inc |
| Parts packaging code | QFN |
| package instruction | HVQCCN, |
| Contacts | 28 |
| Reach Compliance Code | unknow |
| JESD-30 code | S-XQCC-N28 |
| length | 5 mm |
| Number of terminals | 28 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Maximum supply voltage | 2.75 V |
| Minimum supply voltage | 2.25 V |
| Nominal supply voltage | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |
| SI8252-IM | SI8252-IQ | SI8251-IQ | SI8250-IQ | SI8251-IM | SI8250-IM | MULTIPHSPOL-RD | |
|---|---|---|---|---|---|---|---|
| Description | gate drivers smps controller | gate drivers smps controller | gate drivers smps controller | supervisory circuits smps controller | gate drivers smps controller | supervisory circuits smps controller | KIT REFERENCE DESIGN FOR SI825X |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | - |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | - |
| Maker | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | - |
| Parts packaging code | QFN | QFP | QFP | QFP | QFN | QFN | - |
| package instruction | HVQCCN, | LQFP, | LQFP, | LQFP, | HVQCCN, | HVQCCN, | - |
| Contacts | 28 | 32 | 32 | 32 | 28 | 28 | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | - |
| JESD-30 code | S-XQCC-N28 | S-PQFP-G32 | S-PQFP-G32 | S-PQFP-G32 | S-XQCC-N28 | S-XQCC-N28 | - |
| length | 5 mm | 7 mm | 7 mm | 7 mm | 5 mm | 5 mm | - |
| Number of terminals | 28 | 32 | 32 | 32 | 28 | 28 | - |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | - |
| encapsulated code | HVQCCN | LQFP | LQFP | LQFP | HVQCCN | HVQCCN | - |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | 1 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1 mm | 1 mm | - |
| Maximum supply voltage | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V | - |
| Minimum supply voltage | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | - |
| Nominal supply voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| surface mount | YES | YES | YES | YES | YES | YES | - |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| Terminal form | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | - |
| Terminal pitch | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm | - |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 5 mm | 7 mm | 7 mm | 7 mm | 5 mm | 5 mm | - |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | - |
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