KIT REFERENCE DESIGN FOR SI825X
| Parameter Name | Attribute value |
| The main purpose | DC/DC, step down |
| Output and type | 1. Non-isolation |
| Voltage - Output | 3.3V |
| Current - Output | 40A |
| Voltage - input | 10 V ~ 15 V |
| Regulator topology | step down |
| Frequency - Switch | 391kHz |
| Board type | completely filled |
| What's included | boards, cables, accessories |
| IC/parts used | SI8250，SI8251，SI8252 |
| MULTIPHSPOL-RD | SI8252-IQ | SI8251-IQ | SI8250-IQ | SI8252-IM | SI8251-IM | SI8250-IM | |
|---|---|---|---|---|---|---|---|
| Description | KIT REFERENCE DESIGN FOR SI825X | gate drivers smps controller | gate drivers smps controller | supervisory circuits smps controller | gate drivers smps controller | gate drivers smps controller | supervisory circuits smps controller |
| Is it lead-free? | - | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | - | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | - | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc |
| Parts packaging code | - | QFP | QFP | QFP | QFN | QFN | QFN |
| package instruction | - | LQFP, | LQFP, | LQFP, | HVQCCN, | HVQCCN, | HVQCCN, |
| Contacts | - | 32 | 32 | 32 | 28 | 28 | 28 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | unknow | unknow |
| JESD-30 code | - | S-PQFP-G32 | S-PQFP-G32 | S-PQFP-G32 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 |
| length | - | 7 mm | 7 mm | 7 mm | 5 mm | 5 mm | 5 mm |
| Number of terminals | - | 32 | 32 | 32 | 28 | 28 | 28 |
| Maximum operating temperature | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | - | LQFP | LQFP | LQFP | HVQCCN | HVQCCN | HVQCCN |
| Package shape | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | - | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | 1.6 mm | 1.6 mm | 1.6 mm | 1 mm | 1 mm | 1 mm |
| Maximum supply voltage | - | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V |
| Minimum supply voltage | - | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
| Nominal supply voltage | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| surface mount | - | YES | YES | YES | YES | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal form | - | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | - | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 7 mm | 7 mm | 7 mm | 5 mm | 5 mm | 5 mm |
| uPs/uCs/peripheral integrated circuit type | - | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
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