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IS61WV25616BLL-10BLA3

Description
Standard SRAM, 256KX16, 10ns, CMOS, PBGA48
Categorystorage    storage   
File Size206KB,21 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
Environmental Compliance
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IS61WV25616BLL-10BLA3 Overview

Standard SRAM, 256KX16, 10ns, CMOS, PBGA48

IS61WV25616BLL-10BLA3 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid113260097
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time10 ns
I/O typeCOMMON
JESD-30 codeR-PBGA-B48
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA48,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Parallel/SerialPARALLEL
power supply2.5/3.3 V
Certification statusNot Qualified
Filter levelAEC-Q100
Maximum standby current0.015 A
Minimum standby current2 V
Maximum slew rate0.065 mA
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM

IS61WV25616BLL-10BLA3 Related Products

IS61WV25616BLL-10BLA3 IS61WV25616BLL-10BA3 IS61WV25616BLL-10CTA3
Description Standard SRAM, 256KX16, 10ns, CMOS, PBGA48 Standard SRAM, 256KX16, 10ns, CMOS, PBGA48 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44,
Is it Rohs certified? conform to incompatible incompatible
Objectid 113260097 113260096 113260098
Reach Compliance Code compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 10 ns 10 ns 10 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-PBGA-B48 R-PBGA-B48 R-PDSO-G44
memory density 4194304 bit 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16
Number of terminals 48 48 44
word count 262144 words 262144 words 262144 words
character code 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C
organize 256KX16 256KX16 256KX16
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA TSOP
Encapsulate equivalent code BGA48,6X8,30 BGA48,6X8,30 TSOP44,.46,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
power supply 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Filter level AEC-Q100 AEC-Q100 AEC-Q100
Maximum standby current 0.015 A 0.015 A 0.015 A
Minimum standby current 2 V 2 V 2 V
Maximum slew rate 0.065 mA 0.065 mA 0.065 mA
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form BALL BALL GULL WING
Terminal pitch 0.75 mm 0.75 mm 0.8 mm
Terminal location BOTTOM BOTTOM DUAL
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