Standard SRAM, 256KX16, 10ns, CMOS, PBGA48
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 113260096 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 10 ns |
I/O type | COMMON |
JESD-30 code | R-PBGA-B48 |
memory density | 4194304 bit |
Memory IC Type | STANDARD SRAM |
memory width | 16 |
Number of terminals | 48 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
organize | 256KX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA48,6X8,30 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH |
Parallel/Serial | PARALLEL |
power supply | 2.5/3.3 V |
Certification status | Not Qualified |
Filter level | AEC-Q100 |
Maximum standby current | 0.015 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.065 mA |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
IS61WV25616BLL-10BA3 | IS61WV25616BLL-10BLA3 | IS61WV25616BLL-10CTA3 | |
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Description | Standard SRAM, 256KX16, 10ns, CMOS, PBGA48 | Standard SRAM, 256KX16, 10ns, CMOS, PBGA48 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, |
Is it Rohs certified? | incompatible | conform to | incompatible |
Objectid | 113260096 | 113260097 | 113260098 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 10 ns | 10 ns | 10 ns |
I/O type | COMMON | COMMON | COMMON |
JESD-30 code | R-PBGA-B48 | R-PBGA-B48 | R-PDSO-G44 |
memory density | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 16 | 16 | 16 |
Number of terminals | 48 | 48 | 44 |
word count | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
organize | 256KX16 | 256KX16 | 256KX16 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | FBGA | FBGA | TSOP |
Encapsulate equivalent code | BGA48,6X8,30 | BGA48,6X8,30 | TSOP44,.46,32 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
power supply | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Filter level | AEC-Q100 | AEC-Q100 | AEC-Q100 |
Maximum standby current | 0.015 A | 0.015 A | 0.015 A |
Minimum standby current | 2 V | 2 V | 2 V |
Maximum slew rate | 0.065 mA | 0.065 mA | 0.065 mA |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
Terminal form | BALL | BALL | GULL WING |
Terminal pitch | 0.75 mm | 0.75 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM | DUAL |