A3PN250 datasheet, PDF - EEWORLD Datasheet

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A3PN250: DescriptionFPGA, 1536 CLBS, 60000 GATES, PQFP100; Categorysemiconductor Programmable logic devices; File Size6MB，114 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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A3PN250 Overview

FPGA, 1536 CLBS, 60000 GATES, PQFP100

A3PN250 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	100
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	1.58 V
Minimum supply/operating voltage	1.42 V
Rated supply voltage	1.5 V
Processing package description	14 × 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
state	ACTIVE
Craftsmanship	CMOS
packaging shape	SQUARE
Package Size	FLATPACK, THIN PROFILE, FINE PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
terminal coating	MATTE Tin
Terminal location	Four
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
organize	1536 CLBS, 60,000 doors
Number of configurable logic modules	1536
Programmable logic type	FIELD PROGRAMMABLE GATE array
Number of equivalent gate circuits	60000

A3PN250 Related Products

	A3PN250	A3PN010	A3PN125	A3PN020
Description	FPGA, 1536 CLBS, 60000 GATES, PQFP100	FPGA, 1536 CLBS, 60000 GATES, PQFP100	FPGA, 1536 CLBS, 60000 GATES, PQFP100	FPGA, 1536 CLBS, 60000 GATES, PQFP100
Number of functions	1	1	1	1
Number of terminals	100	100	100	100
Maximum operating temperature	85 Cel	85 Cel	85 Cel	85 Cel
Minimum operating temperature	-40 Cel	-40 Cel	-40 Cel	-40 Cel
Maximum supply/operating voltage	1.58 V	1.58 V	1.58 V	1.58 V
Minimum supply/operating voltage	1.42 V	1.42 V	1.42 V	1.42 V
Rated supply voltage	1.5 V	1.5 V	1.5 V	1.5 V
Processing package description	14 × 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100	14 × 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100	14 × 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100	14 × 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
state	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Craftsmanship	CMOS	CMOS	CMOS	CMOS
packaging shape	SQUARE	SQUARE	SQUARE	SQUARE
Package Size	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH
surface mount	Yes	Yes	Yes	Yes
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal spacing	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm
terminal coating	MATTE Tin	MATTE Tin	MATTE Tin	MATTE Tin
Terminal location	Four	Four	Four	Four
Packaging Materials	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
organize	1536 CLBS, 60,000 doors	1536 CLBS, 60,000 doors	1536 CLBS, 60,000 doors	1536 CLBS, 60,000 doors
Number of configurable logic modules	1536	1536	1536	1536
Programmable logic type	FIELD PROGRAMMABLE GATE array	FIELD PROGRAMMABLE GATE array	FIELD PROGRAMMABLE GATE array	FIELD PROGRAMMABLE GATE array
Number of equivalent gate circuits	60000	60000	60000	60000

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