PZU5.1B2L datasheet, PDF - EEWORLD Datasheet

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PZU5.1B2L: DescriptionSingle Zener diodes; CategoryDiscrete semiconductor diode; File Size115KB，13 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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PZU5.1B2L Overview

Single Zener diodes

PZU5.1B2L Parametric

Parameter Name	Attribute value
Source Url Status Check Date	2013-06-14 00:00:00
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	DFN
package instruction	1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SMD, 2 PIN
Contacts	2
Reach Compliance Code	compli
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	60 Ω
JESD-30 code	R-PBCC-N2
JESD-609 code	e3
Humidity sensitivity level	1
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	260
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.25 W
Certification status	Not Qualified
Nominal reference voltage	5.1 V
surface mount	YES
technology	ZENER
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
Maximum voltage tolerance	2%
Working test current	5 mA
Base Number Matches	1

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PZUxBL series

Single Zener diodes

Rev. 01 — 6 May 2008

Product data sheet

1. Product proﬁle

1.1 General description

General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted

Device (SMD) plastic package.

1.2 Features

Non-repetitive peak reverse power

dissipation: P

ZSM

≤

40 W

Total power dissipation: P

tot

≤

250 mW

Tolerance series:

B: approximately

±5

B2: approximately

±2

Wide working voltage range:

nominal 2.4 V to 36 V (E24 range)

Low reverse current I

range

Small plastic package suitable for

surface-mounted design

AEC-Q101 qualiﬁed

1.3 Applications

General regulation functions

1.4 Quick reference data

Table 1.

Symbol

ZSM

tot

[1]

[2]

[3]

[4]

Quick reference data

Parameter

forward voltage

non-repetitive peak reverse

power dissipation

total power dissipation

amb

≤

°C

Conditions

= 100 mA

[1]

[2]

Min

Typ

Max

1.1

250

Unit

[3][4]

Pulse test: t

≤

300

µs; δ ≤

0.02.

= 100

µs;

square wave; T

= 25

°C

prior to surge

Reﬂow soldering is the only recommended soldering method.

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

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