SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68
Parameter Name | Attribute value |
Maker | Microsemi |
package instruction | CERAMIC, QFP-68 |
Reach Compliance Code | unknown |
Maximum access time | 25 ns |
I/O type | COMMON |
JESD-30 code | S-CQFP-G68 |
JESD-609 code | e0 |
length | 22.355 mm |
memory density | 4194304 bit |
Memory IC Type | SRAM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 128KX32 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QFP |
Encapsulate equivalent code | QFP68,.99SQ,50 |
Package shape | SQUARE |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 5.1 mm |
Minimum standby current | 2 V |
Maximum slew rate | 0.6 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
width | 22.36 mm |