AM2910A/BUA datasheet, PDF - EEWORLD Datasheet

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AM2910A/BUA: DescriptionMicroprogram Sequencer, 12-Bit, TTL, CQCC44, CERAMIC, LCC-44; CategoryThe embedded processor and controller Microcontrollers and processors; File Size908KB，27 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM2910A/BUA Overview

Microprogram Sequencer, 12-Bit, TTL, CQCC44, CERAMIC, LCC-44

AM2910A/BUA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	LCC
package instruction	QCCN, LCC44,.65SQ
Contacts	44
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
maximum clock frequency	19.61 MHz
External data bus width	12
JESD-30 code	S-CQCC-N44
JESD-609 code	e0
length	16.51 mm
Number of terminals	44
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC44,.65SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	1.905 mm
Maximum slew rate	340 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.51 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

AM2910A/BUA Related Products

	AM2910A/BUA	AM2910ADCB	AM2910ADC	AM2910APC	AM2910APCB	AM2910A/BQA	AM2910A/BYC
Description	Microprogram Sequencer, 12-Bit, TTL, CQCC44, CERAMIC, LCC-44	Microprogram Sequencer, 12-Bit, TTL, CDIP40, HERMETIC SEALED, CERDIP-40	Microprogram Sequencer, 12-Bit, TTL, CDIP40, HERMETIC SEALED, CERDIP-40	Microprogram Sequencer, 12-Bit, TTL, PDIP40, PLASTIC, DIP-40	Microprogram Sequencer, 12-Bit, TTL, PDIP40, PLASTIC,DIP-40	Microprogram Sequencer, 12-Bit, TTL, CDIP40, CERAMIC,DIP-40	Microprogram Sequencer, 12-Bit, TTL, CDFP42, CERAMIC, FP-42
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	LCC	DIP	DIP	DIP	DIP	DIP	DFP
package instruction	QCCN, LCC44,.65SQ	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DFP, FL42,.6
Contacts	44	40	40	40	40	40	42
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknown	unknown
maximum clock frequency	19.61 MHz	20 MHz	20 MHz	20 MHz	20 MHz	19.61 MHz	19.61 MHz
External data bus width	12	12	12	12	12	12	12
JESD-30 code	S-CQCC-N44	R-GDIP-T40	R-GDIP-T40	R-PDIP-T40	R-PDIP-T40	R-GDIP-T40	R-CDFP-F42
Number of terminals	44	40	40	40	40	40	42
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	DIP	DIP	DIP	DIP	DIP	DFP
Encapsulate equivalent code	LCC44,.65SQ	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	FL42,.6
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.905 mm	5.715 mm	5.715 mm	5.08 mm	5.715 mm	5.588 mm	2.4892 mm
Maximum slew rate	340 mA	344 mA	344 mA	344 mA	344 mA	340 mA	340 mA
Maximum supply voltage	5.5 V	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	NO	NO	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16.51 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	16.256 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Maker	AMD	AMD	-	-	-	AMD	AMD
JESD-609 code	e0	e0	-	e0	e0	e0	e0
length	16.51 mm	52.07 mm	52.07 mm	52.07 mm	52.324 mm	52.324 mm	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Base Number Matches	-	1	1	1	1	1	-

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