Microprogram Sequencer, 12-Bit, TTL, PDIP40, PLASTIC,DIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | unknow |
| maximum clock frequency | 20 MHz |
| External data bus width | 12 |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| length | 52.324 mm |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.715 mm |
| Maximum slew rate | 344 mA |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| Base Number Matches | 1 |
| AM2910APCB | AM2910ADCB | AM2910ADC | AM2910APC | AM2910A/BQA | AM2910A/BYC | AM2910A/BUA | |
|---|---|---|---|---|---|---|---|
| Description | Microprogram Sequencer, 12-Bit, TTL, PDIP40, PLASTIC,DIP-40 | Microprogram Sequencer, 12-Bit, TTL, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprogram Sequencer, 12-Bit, TTL, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprogram Sequencer, 12-Bit, TTL, PDIP40, PLASTIC, DIP-40 | Microprogram Sequencer, 12-Bit, TTL, CDIP40, CERAMIC,DIP-40 | Microprogram Sequencer, 12-Bit, TTL, CDFP42, CERAMIC, FP-42 | Microprogram Sequencer, 12-Bit, TTL, CQCC44, CERAMIC, LCC-44 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DFP | LCC |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DFP, FL42,.6 | QCCN, LCC44,.65SQ |
| Contacts | 40 | 40 | 40 | 40 | 40 | 42 | 44 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknown | unknown | unknow |
| maximum clock frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 19.61 MHz | 19.61 MHz | 19.61 MHz |
| External data bus width | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| JESD-30 code | R-PDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-PDIP-T40 | R-GDIP-T40 | R-CDFP-F42 | S-CQCC-N44 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 42 | 44 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DFP | QCCN |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | FL42,.6 | LCC44,.65SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.715 mm | 5.715 mm | 5.715 mm | 5.08 mm | 5.588 mm | 2.4892 mm | 1.905 mm |
| Maximum slew rate | 344 mA | 344 mA | 344 mA | 344 mA | 340 mA | 340 mA | 340 mA |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 16.256 mm | 16.51 mm |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 | e0 |
| length | 52.324 mm | 52.07 mm | 52.07 mm | 52.07 mm | 52.324 mm | - | 16.51 mm |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
| Maker | - | AMD | - | - | AMD | AMD | AMD |
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