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IS24C16A-3ZLA3

Description
EEPROM, 2KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8
Categorystorage    storage   
File Size766KB,22 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
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IS24C16A-3ZLA3 Overview

EEPROM, 2KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8

IS24C16A-3ZLA3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP8,.25
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)1 MHz
Data retention time - minimum100
Durability1000000 Write/Erase Cycles
I2C control byte1010MMMR
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.4 mm
memory density16384 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize2KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Serial bus typeI2C
Maximum standby current0.000002 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Maximum write cycle time (tWC)10 ms
write protectHARDWARE

IS24C16A-3ZLA3 Related Products

IS24C16A-3ZLA3 IS24C04A-2CLI IS24C02A-2CLI IS24C02A-2PLI IS24C02A-2DLI-TR IS24C08A-3GLA3 IS24C08A-3ZLA3 IS24C16A-3GLA3
Description EEPROM, 2KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8 EEPROM, 512X8, Serial, CMOS, LEAD FREE, DIE-8 EEPROM, 256X8, Serial, CMOS, LEAD FREE, DIE-8 EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 EEPROM, 256X8, Serial, CMOS, PDSO8, 2 X 3 MM, LEAD FREE, MO-229, DFN-8 EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8 EEPROM, 1KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8 EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code TSSOP DIE DIE DIP SON SOIC TSSOP SOIC
package instruction TSSOP, TSSOP8,.25 DIE, DIE, DIP, DIP8,.3 2 X 3 MM, LEAD FREE, MO-229, DFN-8 SOP, SOP8,.25 TSSOP, TSSOP8,.25 SOP, SOP8,.25
Contacts 8 8 8 8 8 8 8 8
Reach Compliance Code compli compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
JESD-30 code R-PDSO-G8 R-XUUC-N8 R-XUUC-N8 R-PDIP-T8 R-PDSO-N8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 e1 e1 e3 e3 e3 e3 e3
memory density 16384 bi 4096 bit 2048 bit 2048 bit 2048 bit 8192 bit 8192 bit 16384 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8 8
word count 2048 words 512 words 256 words 256 words 256 words 1024 words 1024 words 2048 words
character code 2000 512 256 256 256 1000 1000 2000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 85 °C 85 °C 85 °C 85 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 2KX8 512X8 256X8 256X8 256X8 1KX8 1KX8 2KX8
Package body material PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP DIE DIE DIP HVSON SOP TSSOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH UNCASED CHIP UNCASED CHIP IN-LINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type I2C I2C I2C I2C I2C I2C I2C I2C
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.5 V 1.8 V 1.8 V 1.8 V 1.8 V 2.5 V 2.5 V 2.5 V
Nominal supply voltage (Vsup) 5 V 2.5 V 2.5 V 2.5 V 2.5 V 5 V 5 V 5 V
surface mount YES YES YES NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form GULL WING NO LEAD NO LEAD THROUGH-HOLE NO LEAD GULL WING GULL WING GULL WING
Terminal location DUAL UPPER UPPER DUAL DUAL DUAL DUAL DUAL
Maximum write cycle time (tWC) 10 ms 5 ms 5 ms 5 ms 5 ms 10 ms 10 ms 10 ms
Is it lead-free? Lead free Lead free - - - Lead free Lead free Lead free
Data retention time - minimum 100 - - 100 100 100 100 100
Durability 1000000 Write/Erase Cycles - - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010MMMR - - 1010DDDR 1010DDDR 1010DMMR 1010DMMR 1010MMMR
length 4.4 mm - - 9.27 mm 3 mm 4.9 mm 4.4 mm 4.9 mm
Encapsulate equivalent code TSSOP8,.25 - - DIP8,.3 SOLCC8,.11,20 SOP8,.25 TSSOP8,.25 SOP8,.25
Peak Reflow Temperature (Celsius) 260 260 - 260 - 260 260 260
power supply 3/5 V - - 2/5 V 2/5 V 3/5 V 3/5 V 3/5 V
Maximum seat height 1.2 mm - - 4.2 mm 0.8 mm 1.75 mm 1.2 mm 1.75 mm
Maximum standby current 0.000002 A - - 0.000001 A 0.000001 A 0.000002 A 0.000002 A 0.000002 A
Maximum slew rate 0.003 mA - - 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Terminal pitch 0.65 mm - - 2.54 mm 0.5 mm 1.27 mm 0.65 mm 1.27 mm
Maximum time at peak reflow temperature 40 40 - 40 - 40 40 40
width 3 mm - - 7.62 mm 2 mm 3.9 mm 3 mm 3.9 mm
write protect HARDWARE - - HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE

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