IS24C02A-2DLI-TR datasheet, PDF

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IS24C02A-2DLI-TR: DescriptionEEPROM, 256X8, Serial, CMOS, PDSO8, 2 X 3 MM, LEAD FREE, MO-229, DFN-8; Categorystorage storage; File Size766KB，22 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS24C02A-2DLI-TR Overview

EEPROM, 256X8, Serial, CMOS, PDSO8, 2 X 3 MM, LEAD FREE, MO-229, DFN-8

IS24C02A-2DLI-TR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	SON
package instruction	2 X 3 MM, LEAD FREE, MO-229, DFN-8
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	1 MHz
Data retention time - minimum	100
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-PDSO-N8
JESD-609 code	e3
length	3 mm
memory density	2048 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	256 words
character code	256
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256X8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Encapsulate equivalent code	SOLCC8,.11,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	0.8 mm
Serial bus type	I2C
Maximum standby current	0.000001 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
width	2 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE

IS24C02A-2DLI-TR Related Products

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Description	EEPROM, 256X8, Serial, CMOS, PDSO8, 2 X 3 MM, LEAD FREE, MO-229, DFN-8	EEPROM, 512X8, Serial, CMOS, LEAD FREE, DIE-8	EEPROM, 256X8, Serial, CMOS, LEAD FREE, DIE-8	EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8	EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8	EEPROM, 1KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8	EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8	EEPROM, 2KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	SON	DIE	DIE	DIP	SOIC	TSSOP	SOIC	TSSOP
package instruction	2 X 3 MM, LEAD FREE, MO-229, DFN-8	DIE,	DIE,	DIP, DIP8,.3	SOP, SOP8,.25	TSSOP, TSSOP8,.25	SOP, SOP8,.25	TSSOP, TSSOP8,.25
Contacts	8	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz
JESD-30 code	R-PDSO-N8	R-XUUC-N8	R-XUUC-N8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e3	e1	e1	e3	e3	e3	e3	e3
memory density	2048 bit	4096 bit	2048 bit	2048 bit	8192 bit	8192 bit	16384 bit	16384 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8	8
word count	256 words	512 words	256 words	256 words	1024 words	1024 words	2048 words	2048 words
character code	256	512	256	256	1000	1000	2000	2000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256X8	512X8	256X8	256X8	1KX8	1KX8	2KX8	2KX8
Package body material	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVSON	DIE	DIE	DIP	SOP	TSSOP	SOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	UNCASED CHIP	UNCASED CHIP	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	2.5 V	2.5 V	2.5 V	2.5 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Matte Tin (Sn) - annealed	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	DUAL	UPPER	UPPER	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	10 ms	10 ms	10 ms	10 ms
Data retention time - minimum	100	-	-	100	100	100	100	100
Durability	1000000 Write/Erase Cycles	-	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	1010DDDR	-	-	1010DDDR	1010DMMR	1010DMMR	1010MMMR	1010MMMR
length	3 mm	-	-	9.27 mm	4.9 mm	4.4 mm	4.9 mm	4.4 mm
Encapsulate equivalent code	SOLCC8,.11,20	-	-	DIP8,.3	SOP8,.25	TSSOP8,.25	SOP8,.25	TSSOP8,.25
power supply	2/5 V	-	-	2/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Maximum seat height	0.8 mm	-	-	4.2 mm	1.75 mm	1.2 mm	1.75 mm	1.2 mm
Maximum standby current	0.000001 A	-	-	0.000001 A	0.000002 A	0.000002 A	0.000002 A	0.000002 A
Maximum slew rate	0.003 mA	-	-	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Terminal pitch	0.5 mm	-	-	2.54 mm	1.27 mm	0.65 mm	1.27 mm	0.65 mm
width	2 mm	-	-	7.62 mm	3.9 mm	3 mm	3.9 mm	3 mm
write protect	HARDWARE	-	-	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Is it lead-free?	-	Lead free	-	-	Lead free	Lead free	Lead free	Lead free
Peak Reflow Temperature (Celsius)	-	260	-	260	260	260	260	260
Maximum time at peak reflow temperature	-	40	-	40	40	40	40	40

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