IS24C04A-2CLI datasheet, PDF - EEWORLD Datasheet

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IS24C04A-2CLI: DescriptionEEPROM, 512X8, Serial, CMOS, LEAD FREE, DIE-8; Categorystorage storage; File Size766KB，22 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS24C04A-2CLI Overview

EEPROM, 512X8, Serial, CMOS, LEAD FREE, DIE-8

IS24C04A-2CLI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	DIE
package instruction	DIE,
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	1 MHz
JESD-30 code	R-XUUC-N8
JESD-609 code	e1
memory density	4096 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512X8
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Serial bus type	I2C
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	40
Maximum write cycle time (tWC)	5 ms
Base Number Matches	1

IS24C04A-2CLI Related Products

	IS24C04A-2CLI	IS24C02A-2CLI	IS24C02A-2PLI	IS24C02A-2DLI-TR	IS24C08A-3GLA3	IS24C08A-3ZLA3	IS24C16A-3GLA3	IS24C16A-3ZLA3
Description	EEPROM, 512X8, Serial, CMOS, LEAD FREE, DIE-8	EEPROM, 256X8, Serial, CMOS, LEAD FREE, DIE-8	EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8	EEPROM, 256X8, Serial, CMOS, PDSO8, 2 X 3 MM, LEAD FREE, MO-229, DFN-8	EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8	EEPROM, 1KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8	EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8	EEPROM, 2KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	DIE	DIE	DIP	SON	SOIC	TSSOP	SOIC	TSSOP
package instruction	DIE,	DIE,	DIP, DIP8,.3	2 X 3 MM, LEAD FREE, MO-229, DFN-8	SOP, SOP8,.25	TSSOP, TSSOP8,.25	SOP, SOP8,.25	TSSOP, TSSOP8,.25
Contacts	8	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz
JESD-30 code	R-XUUC-N8	R-XUUC-N8	R-PDIP-T8	R-PDSO-N8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e1	e1	e3	e3	e3	e3	e3	e3
memory density	4096 bit	2048 bit	2048 bit	2048 bit	8192 bit	8192 bit	16384 bit	16384 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8	8
word count	512 words	256 words	256 words	256 words	1024 words	1024 words	2048 words	2048 words
character code	512	256	256	256	1000	1000	2000	2000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	512X8	256X8	256X8	256X8	1KX8	1KX8	2KX8	2KX8
Package body material	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIE	DIE	DIP	HVSON	SOP	TSSOP	SOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	UNCASED CHIP	IN-LINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	2.5 V	2.5 V	2.5 V	2.5 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	UPPER	UPPER	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	10 ms	10 ms	10 ms	10 ms
Is it lead-free?	Lead free	-	-	-	Lead free	Lead free	Lead free	Lead free
Peak Reflow Temperature (Celsius)	260	-	260	-	260	260	260	260
Maximum time at peak reflow temperature	40	-	40	-	40	40	40	40
Data retention time - minimum	-	-	100	100	100	100	100	100
Durability	-	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	-	-	1010DDDR	1010DDDR	1010DMMR	1010DMMR	1010MMMR	1010MMMR
length	-	-	9.27 mm	3 mm	4.9 mm	4.4 mm	4.9 mm	4.4 mm
Encapsulate equivalent code	-	-	DIP8,.3	SOLCC8,.11,20	SOP8,.25	TSSOP8,.25	SOP8,.25	TSSOP8,.25
power supply	-	-	2/5 V	2/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Maximum seat height	-	-	4.2 mm	0.8 mm	1.75 mm	1.2 mm	1.75 mm	1.2 mm
Maximum standby current	-	-	0.000001 A	0.000001 A	0.000002 A	0.000002 A	0.000002 A	0.000002 A
Maximum slew rate	-	-	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Terminal pitch	-	-	2.54 mm	0.5 mm	1.27 mm	0.65 mm	1.27 mm	0.65 mm
width	-	-	7.62 mm	2 mm	3.9 mm	3 mm	3.9 mm	3 mm
write protect	-	-	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE

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