X25F047P-5 datasheet, PDF - EEWORLD Datasheet

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X25F047P-5: DescriptionFlash, 512X8, PDIP8, MINI, PLASTIC, DIP-8; Categorystorage storage; File Size70KB，14 Pages; ManufacturerXicor Inc.

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X25F047P-5 Overview

Flash, 512X8, PDIP8, MINI, PLASTIC, DIP-8

X25F047P-5 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Xicor Inc.
package instruction	MINI, PLASTIC, DIP-8
Reach Compliance Code	unknow
Other features	SPI SERIAL FLASH
Maximum clock frequency (fCLK)	1 MHz
Data retention time - minimum	100
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	10.03 mm
memory density	4096 bi
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	4.32 mm
Serial bus type	SPI
Maximum standby current	0.000001 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
type	NOR TYPE
width	7.62 mm
write protect	HARDWARE/SOFTWARE

X25F047P-5 Related Products

	X25F047P-5	X25F047VI-5	X25F047V	X25F047V-5	X25F047MI-5	X25F047M	X25F047M-5
Description	Flash, 512X8, PDIP8, MINI, PLASTIC, DIP-8	Flash, 512X8, PDSO8, PLASTIC, TSSOP-8	Flash, 512X8, PDSO8, PLASTIC, TSSOP-8	Flash, 512X8, PDSO8, PLASTIC, TSSOP-8	Flash, 512X8, PDSO8, MSOP-8	Flash, 512X8, PDSO8, MSOP-8	Flash, 512X8, PDSO8, MSOP-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	MINI, PLASTIC, DIP-8	PLASTIC, TSSOP-8	PLASTIC, TSSOP-8	PLASTIC, TSSOP-8	MSOP-8	MSOP-8	MSOP-8
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown
Maximum clock frequency (fCLK)	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz
Data retention time - minimum	100	100	100	100	100	100	100
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	S-PDSO-G8	S-PDSO-G8	S-PDSO-G8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	10.03 mm	4.4 mm	4.4 mm	4.4 mm	3 mm	3 mm	3 mm
memory density	4096 bi	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	85 °C	70 °C	70 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8	512X8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP
Encapsulate equivalent code	DIP8,.3	TSSOP8,.25	TSSOP8,.25	TSSOP8,.25	TSSOP8,.19	TSSOP8,.19	TSSOP8,.19
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
power supply	5 V	5 V	2/3.3 V	5 V	5 V	2/3.3 V	5 V
Programming voltage	5 V	5 V	3 V	5 V	5 V	3 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.32 mm	1.2 mm	1.2 mm	1.2 mm	1.07 mm	1.07 mm	1.07 mm
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI	SPI
Maximum standby current	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	3.6 V	5.5 V	5.5 V	3.6 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	1.8 V	4.5 V	4.5 V	1.8 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	3.3 V	5 V	5 V	3.3 V	5 V
surface mount	NO	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	7.62 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Maker	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	-	-	Xicor Inc.
Base Number Matches	-	1	1	1	1	1	-

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