EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

X25F047MI-5

Description
Flash, 512X8, PDSO8, MSOP-8
Categorystorage    storage   
File Size70KB,14 Pages
ManufacturerXicor Inc.
Download Datasheet Parametric Compare View All

X25F047MI-5 Overview

Flash, 512X8, PDSO8, MSOP-8

X25F047MI-5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionMSOP-8
Reach Compliance Codeunknown
Maximum clock frequency (fCLK)1 MHz
Data retention time - minimum100
Durability100000 Write/Erase Cycles
JESD-30 codeS-PDSO-G8
JESD-609 codee0
length3 mm
memory density4096 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals8
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512X8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height1.07 mm
Serial bus typeSPI
Maximum standby current0.000001 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
typeNOR TYPE
width3 mm
write protectHARDWARE/SOFTWARE
Base Number Matches1

X25F047MI-5 Related Products

X25F047MI-5 X25F047VI-5 X25F047V X25F047V-5 X25F047M X25F047M-5 X25F047P-5
Description Flash, 512X8, PDSO8, MSOP-8 Flash, 512X8, PDSO8, PLASTIC, TSSOP-8 Flash, 512X8, PDSO8, PLASTIC, TSSOP-8 Flash, 512X8, PDSO8, PLASTIC, TSSOP-8 Flash, 512X8, PDSO8, MSOP-8 Flash, 512X8, PDSO8, MSOP-8 Flash, 512X8, PDIP8, MINI, PLASTIC, DIP-8
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction MSOP-8 PLASTIC, TSSOP-8 PLASTIC, TSSOP-8 PLASTIC, TSSOP-8 MSOP-8 MSOP-8 MINI, PLASTIC, DIP-8
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
Maximum clock frequency (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
Data retention time - minimum 100 100 100 100 100 100 100
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 S-PDSO-G8 S-PDSO-G8 R-PDIP-T8
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 3 mm 4.4 mm 4.4 mm 4.4 mm 3 mm 3 mm 10.03 mm
memory density 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
word count 512 words 512 words 512 words 512 words 512 words 512 words 512 words
character code 512 512 512 512 512 512 512
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512X8 512X8 512X8 512X8 512X8 512X8 512X8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP DIP
Encapsulate equivalent code TSSOP8,.19 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25 TSSOP8,.19 TSSOP8,.19 DIP8,.3
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
power supply 5 V 5 V 2/3.3 V 5 V 2/3.3 V 5 V 5 V
Programming voltage 5 V 5 V 3 V 5 V 3 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.07 mm 1.2 mm 1.2 mm 1.2 mm 1.07 mm 1.07 mm 4.32 mm
Serial bus type SPI SPI SPI SPI SPI SPI SPI
Maximum standby current 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 3.6 V 5.5 V 3.6 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 1.8 V 4.5 V 1.8 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 3.3 V 5 V 3.3 V 5 V 5 V
surface mount YES YES YES YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 7.62 mm
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1 1 1 1 - -
Maker - Xicor Inc. Xicor Inc. Xicor Inc. - Xicor Inc. Xicor Inc.
Basics of Model-Based GaN PA Design: GaN Transistor S-Parameters, Linear Stability Analysis, and Resistor Stability
I would like to recommend an article " Basics of Model-Based GaN PA Design " to you, which mainly discusses the importance of GaN HEMT nonlinear models for fast and efficient power amplifier (PA) desi...
alan000345 RF/Wirelessly
How to set the minimum area of Solid Region in Altium
Double-clicking during the drawing process results in some extremely small solid areas in the editing area. Some solid areas are automatically assigned to networks, and similar thin lines are automati...
大小家伙好 PCB Design
LIS3DH sensor high-pass filter question and data refresh rate consultation
I am currently debugging the LIS3DH three-axis acceleration sensor and have come across a few issues. I would like to ask the experts about the main application scenarios: I am going to use this senso...
yanghaii MEMS sensors
Anti-collision mechanism for RFID multi-tag reading
Under normal circumstances, an RFID reader can only read or write one RFID card in the magnetic field at a time. However, in actual applications, multiple cards often enter the reader's radio frequenc...
Jacktang RF/Wirelessly
[GD32L233C-START Review] 11. DAC output voltage value_ADC reads external voltage value
[i=s]This post was last edited by hehung on 2022-2-12 14:25[/i]For previous posts, please refer to:【GD32L233C-START Review】1. Unboxing [GD32L233C-START Review] 2. Create a new project step by step [GD...
hehung GD32 MCU
EEWORLD University ---- Getting started and improving vivado
Vivado Getting Started and Advanced : https://training.eeworld.com.cn/course/5728This course introduces the use of Xilinx's new generation development platform Vivado in detail. It is divided into two...
抛砖引玉 FPGA/CPLD

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号