SOIC-28, Reel
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 28 |
| Manufacturer packaging code | PEG28 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Date Of Intro | 1999-12-13 |
| Samacsys Description | SOIC 330 MIL |
| Maximum access time | 25 ns |
| Other features | PORTA/PORTB:PARALLEL/SERIAL |
| period time | 20 ns |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e3 |
| length | 18.3642 mm |
| memory density | 16384 bit |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 1KX16 |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 3.048 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8.763 mm |
| 72125L25SOG8 | 72125L25TPG | 72125L50TP | 72125L50SO | 72125L25TP | |
|---|---|---|---|---|---|
| Description | SOIC-28, Reel | PDIP-28, Tube | PDIP-28, Tube | SOIC-28, Tube | PDIP-28, Tube |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| Is it lead-free? | Lead free | Lead free | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | conform to | conform to | incompatible | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | SOIC | PDIP | PDIP | SOIC | PDIP |
| package instruction | SOP, | DIP, | DIP, DIP28,.3 | SOIC-28 | DIP, DIP28,.3 |
| Contacts | 28 | 28 | 28 | 28 | 28 |
| Manufacturer packaging code | PEG28 | PTG28 | PT28 | PE28 | PT28 |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 25 ns | 25 ns | 50 ns | 50 ns | 25 ns |
| Other features | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL |
| period time | 20 ns | 20 ns | 25 ns | 25 ns | 20 ns |
| JESD-30 code | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 |
| JESD-609 code | e3 | e3 | e0 | e0 | e0 |
| length | 18.3642 mm | 34.544 mm | 34.544 mm | 18.3642 mm | 34.544 mm |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| memory width | 16 | 16 | 16 | 16 | 16 |
| Humidity sensitivity level | 3 | 1 | 1 | 3 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 1KX16 | 1KX16 | 1KX16 | 1KX16 | 1KX16 |
| Exportable | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | DIP | SOP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 245 | 225 | 245 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.048 mm | 4.57 mm | 4.57 mm | 3.048 mm | 4.57 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 8.763 mm | 7.62 mm | 7.62 mm | 8.763 mm | 7.62 mm |
| Maximum clock frequency (fCLK) | - | - | 15.4 MHz | 15.4 MHz | 28.6 MHz |
| Memory IC Type | - | - | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| Encapsulate equivalent code | - | - | DIP28,.3 | SOP28,.5 | DIP28,.3 |
| power supply | - | - | 5 V | 5 V | 5 V |
| Maximum standby current | - | - | 0.006 A | 0.006 A | 0.006 A |
| Maximum slew rate | - | - | 0.1 mA | 0.1 mA | 0.1 mA |
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