72125L50TP datasheet, PDF - EEWORLD Datasheet

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72125L50TP: DescriptionPDIP-28, Tube; Categorystorage storage; File Size388KB，12 Pages; ManufacturerIDT (Integrated Device Technology)

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72125L50TP Overview

PDIP-28, Tube

72125L50TP Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	PDIP
package instruction	DIP, DIP28,.3
Contacts	28
Manufacturer packaging code	PT28
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	50 ns
Other features	PORTA/PORTB:PARALLEL/SERIAL
Maximum clock frequency (fCLK)	15.4 MHz
period time	25 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	34.544 mm
memory density	16384 bit
Memory IC Type	OTHER FIFO
memory width	16
Humidity sensitivity level	1
Number of functions	1
Number of terminals	28
word count	1024 words
character code	1000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1KX16
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	245
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum standby current	0.006 A
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

72125L50TP Related Products

	72125L50TP	72125L25TPG	72125L50SO	72125L25SOG8	72125L25TP
Description	PDIP-28, Tube	PDIP-28, Tube	SOIC-28, Tube	SOIC-28, Reel	PDIP-28, Tube
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Lead free	Contains lead	Lead free	Contains lead
Is it Rohs certified?	incompatible	conform to	incompatible	conform to	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	PDIP	PDIP	SOIC	SOIC	PDIP
package instruction	DIP, DIP28,.3	DIP,	SOIC-28	SOP,	DIP, DIP28,.3
Contacts	28	28	28	28	28
Manufacturer packaging code	PT28	PTG28	PE28	PEG28	PT28
Reach Compliance Code	not_compliant	compliant	not_compliant	compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	50 ns	25 ns	50 ns	25 ns	25 ns
Other features	PORTA/PORTB:PARALLEL/SERIAL	PORTA/PORTB:PARALLEL/SERIAL	PORTA/PORTB:PARALLEL/SERIAL	PORTA/PORTB:PARALLEL/SERIAL	PORTA/PORTB:PARALLEL/SERIAL
period time	25 ns	20 ns	25 ns	20 ns	20 ns
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28
JESD-609 code	e0	e3	e0	e3	e0
length	34.544 mm	34.544 mm	18.3642 mm	18.3642 mm	34.544 mm
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
memory width	16	16	16	16	16
Humidity sensitivity level	1	1	3	3	1
Number of functions	1	1	1	1	1
Number of terminals	28	28	28	28	28
word count	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1KX16	1KX16	1KX16	1KX16	1KX16
Exportable	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	245	260	225	260	245
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	3.048 mm	3.048 mm	4.57 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Matte Tin (Sn) - annealed	Tin/Lead (Sn85Pb15)	Matte Tin (Sn)	Tin/Lead (Sn85Pb15)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	8.763 mm	8.763 mm	7.62 mm
Maximum clock frequency (fCLK)	15.4 MHz	-	15.4 MHz	-	28.6 MHz
Memory IC Type	OTHER FIFO	-	OTHER FIFO	-	OTHER FIFO
Encapsulate equivalent code	DIP28,.3	-	SOP28,.5	-	DIP28,.3
power supply	5 V	-	5 V	-	5 V
Maximum standby current	0.006 A	-	0.006 A	-	0.006 A
Maximum slew rate	0.1 mA	-	0.1 mA	-	0.1 mA

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