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72125L50SO

Description
SOIC-28, Tube
Categorystorage    storage   
File Size388KB,12 Pages
ManufacturerIDT (Integrated Device Technology)
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72125L50SO Overview

SOIC-28, Tube

72125L50SO Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeSOIC
package instructionSOIC-28
Contacts28
Manufacturer packaging codePE28
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time50 ns
Other featuresPORTA/PORTB:PARALLEL/SERIAL
Maximum clock frequency (fCLK)15.4 MHz
period time25 ns
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length18.3642 mm
memory density16384 bit
Memory IC TypeOTHER FIFO
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals28
word count1024 words
character code1000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1KX16
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.5
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Maximum seat height3.048 mm
Maximum standby current0.006 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8.763 mm

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Description SOIC-28, Tube PDIP-28, Tube PDIP-28, Tube SOIC-28, Reel PDIP-28, Tube
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Lead free Contains lead Lead free Contains lead
Is it Rohs certified? incompatible conform to incompatible conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code SOIC PDIP PDIP SOIC PDIP
package instruction SOIC-28 DIP, DIP, DIP28,.3 SOP, DIP, DIP28,.3
Contacts 28 28 28 28 28
Manufacturer packaging code PE28 PTG28 PT28 PEG28 PT28
Reach Compliance Code not_compliant compliant not_compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 50 ns 25 ns 50 ns 25 ns 25 ns
Other features PORTA/PORTB:PARALLEL/SERIAL PORTA/PORTB:PARALLEL/SERIAL PORTA/PORTB:PARALLEL/SERIAL PORTA/PORTB:PARALLEL/SERIAL PORTA/PORTB:PARALLEL/SERIAL
period time 25 ns 20 ns 25 ns 20 ns 20 ns
JESD-30 code R-PDSO-G28 R-PDIP-T28 R-PDIP-T28 R-PDSO-G28 R-PDIP-T28
JESD-609 code e0 e3 e0 e3 e0
length 18.3642 mm 34.544 mm 34.544 mm 18.3642 mm 34.544 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
memory width 16 16 16 16 16
Humidity sensitivity level 3 1 1 3 1
Number of functions 1 1 1 1 1
Number of terminals 28 28 28 28 28
word count 1024 words 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000 1000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
organize 1KX16 1KX16 1KX16 1KX16 1KX16
Exportable NO NO NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP DIP SOP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 225 260 245 260 245
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.048 mm 4.57 mm 4.57 mm 3.048 mm 4.57 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO YES NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Matte Tin (Sn) Tin/Lead (Sn85Pb15)
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8.763 mm 7.62 mm 7.62 mm 8.763 mm 7.62 mm
Maximum clock frequency (fCLK) 15.4 MHz - 15.4 MHz - 28.6 MHz
Memory IC Type OTHER FIFO - OTHER FIFO - OTHER FIFO
Encapsulate equivalent code SOP28,.5 - DIP28,.3 - DIP28,.3
power supply 5 V - 5 V - 5 V
Maximum standby current 0.006 A - 0.006 A - 0.006 A
Maximum slew rate 0.1 mA - 0.1 mA - 0.1 mA
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