VS8062QH datasheet, PDF - EEWORLD Datasheet

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VS8062QH: DescriptionTelecom Circuit, 1-Func, GAAS, PQFP52, PLASTIC, QFP-52; CategoryWireless rf/communication Telecom circuit; File Size409KB，20 Pages; ManufacturerVitesse Semiconductor Corporation; Websitehttp://www.vitesse.com/

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VS8062QH Overview

Telecom Circuit, 1-Func, GAAS, PQFP52, PLASTIC, QFP-52

VS8062QH Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Vitesse Semiconductor Corporation
Parts packaging code	QFP
package instruction	QFP, QFP52,.68SQ,40
Contacts	52
Reach Compliance Code	unknown
JESD-30 code	S-PQFP-G52
JESD-609 code	e0
length	14 mm
Negative supply voltage rating	-5.2 V
Number of functions	1
Number of terminals	52
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP52,.68SQ,40
Package shape	SQUARE
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	-2,-5.2 V
Certification status	Not Qualified
Maximum seat height	2.35 mm
Maximum slew rate	0.45 mA
surface mount	YES
technology	GAAS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

VS8062QH Related Products

	VS8062QH	VS8061QH	VS8062FI	VS8061FC	VS8061FI	VS8062FC
Description	Telecom Circuit, 1-Func, GAAS, PQFP52, PLASTIC, QFP-52	Telecom Circuit, 1-Func, GAAS, PQFP52, PLASTIC, QFP-52	Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52	Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52	Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52	Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	QFP, QFP52,.68SQ,40	QFP, QFP52,.68SQ,40	HQFF, QFL52,.75SQ	HQFF, QFL52,.75SQ	HQFF, QFL52,.75SQ	HQFF, QFL52,.75SQ
Contacts	52	52	52	52	52	52
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-PQFP-G52	S-PQFP-G52	S-CQFP-F52	S-CQFP-F52	S-CQFP-F52	S-CQFP-F52
JESD-609 code	e0	e0	e0	e0	e0	e0
length	14 mm	14 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm
Negative supply voltage rating	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V
Number of functions	1	1	1	1	1	1
Number of terminals	52	52	52	52	52	52
Maximum operating temperature	85 °C	85 °C	85 °C	70 °C	85 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP	QFP	HQFF	HQFF	HQFF	HQFF
Encapsulate equivalent code	QFP52,.68SQ,40	QFP52,.68SQ,40	QFL52,.75SQ	QFL52,.75SQ	QFL52,.75SQ	QFL52,.75SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.35 mm	2.35 mm	3 mm	3 mm	3 mm	3 mm
Maximum slew rate	0.45 mA	0.52 mA	0.45 mA	0.52 mA	0.52 mA	0.45 mA
surface mount	YES	YES	YES	YES	YES	YES
technology	GAAS	GAAS	GAAS	GAAS	GAAS	GAAS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	OTHER	OTHER	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	FLAT	FLAT	FLAT	FLAT
Terminal pitch	1 mm	1 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm

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