Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Vitesse Semiconductor Corporation |
| Parts packaging code | QFP |
| package instruction | HQFF, QFL52,.75SQ |
| Contacts | 52 |
| Reach Compliance Code | unknown |
| JESD-30 code | S-CQFP-F52 |
| JESD-609 code | e0 |
| length | 19.05 mm |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of terminals | 52 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | HQFF |
| Encapsulate equivalent code | QFL52,.75SQ |
| Package shape | SQUARE |
| Package form | FLATPACK, HEAT SINK/SLUG |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -2,-5.2 V |
| Certification status | Not Qualified |
| Maximum seat height | 3 mm |
| Maximum slew rate | 0.52 mA |
| surface mount | YES |
| technology | GAAS |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 19.05 mm |
| VS8061FC | VS8061QH | VS8062FI | VS8061FI | VS8062FC | VS8062QH | |
|---|---|---|---|---|---|---|
| Description | Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52 | Telecom Circuit, 1-Func, GAAS, PQFP52, PLASTIC, QFP-52 | Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52 | Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52 | Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52 | Telecom Circuit, 1-Func, GAAS, PQFP52, PLASTIC, QFP-52 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Vitesse Semiconductor Corporation | Vitesse Semiconductor Corporation | Vitesse Semiconductor Corporation | Vitesse Semiconductor Corporation | Vitesse Semiconductor Corporation | Vitesse Semiconductor Corporation |
| Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP |
| package instruction | HQFF, QFL52,.75SQ | QFP, QFP52,.68SQ,40 | HQFF, QFL52,.75SQ | HQFF, QFL52,.75SQ | HQFF, QFL52,.75SQ | QFP, QFP52,.68SQ,40 |
| Contacts | 52 | 52 | 52 | 52 | 52 | 52 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-CQFP-F52 | S-PQFP-G52 | S-CQFP-F52 | S-CQFP-F52 | S-CQFP-F52 | S-PQFP-G52 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 19.05 mm | 14 mm | 19.05 mm | 19.05 mm | 19.05 mm | 14 mm |
| Negative supply voltage rating | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 52 | 52 | 52 | 52 | 52 | 52 |
| Maximum operating temperature | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | HQFF | QFP | HQFF | HQFF | HQFF | QFP |
| Encapsulate equivalent code | QFL52,.75SQ | QFP52,.68SQ,40 | QFL52,.75SQ | QFL52,.75SQ | QFL52,.75SQ | QFP52,.68SQ,40 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, HEAT SINK/SLUG | FLATPACK | FLATPACK, HEAT SINK/SLUG | FLATPACK, HEAT SINK/SLUG | FLATPACK, HEAT SINK/SLUG | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | -2,-5.2 V | -2,-5.2 V | -2,-5.2 V | -2,-5.2 V | -2,-5.2 V | -2,-5.2 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3 mm | 2.35 mm | 3 mm | 3 mm | 3 mm | 2.35 mm |
| Maximum slew rate | 0.52 mA | 0.52 mA | 0.45 mA | 0.52 mA | 0.45 mA | 0.45 mA |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | GAAS | GAAS | GAAS | GAAS | GAAS | GAAS |
| Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| Temperature level | COMMERCIAL | OTHER | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | GULL WING | FLAT | FLAT | FLAT | GULL WING |
| Terminal pitch | 1.27 mm | 1 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 19.05 mm | 14 mm | 19.05 mm | 19.05 mm | 19.05 mm | 14 mm |
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