VS8061FI datasheet, PDF - EEWORLD Datasheet

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VS8061FI: DescriptionTelecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52; CategoryWireless rf/communication Telecom circuit; File Size409KB，20 Pages; ManufacturerVitesse Semiconductor Corporation; Websitehttp://www.vitesse.com/

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VS8061FI Overview

Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52

VS8061FI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Vitesse Semiconductor Corporation
Parts packaging code	QFP
package instruction	HQFF, QFL52,.75SQ
Contacts	52
Reach Compliance Code	unknown
JESD-30 code	S-CQFP-F52
JESD-609 code	e0
length	19.05 mm
Negative supply voltage rating	-5.2 V
Number of functions	1
Number of terminals	52
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	HQFF
Encapsulate equivalent code	QFL52,.75SQ
Package shape	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	-2,-5.2 V
Certification status	Not Qualified
Maximum seat height	3 mm
Maximum slew rate	0.52 mA
surface mount	YES
technology	GAAS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	19.05 mm

VS8061FI Related Products

	VS8061FI	VS8061QH	VS8062FI	VS8061FC	VS8062FC	VS8062QH
Description	Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52	Telecom Circuit, 1-Func, GAAS, PQFP52, PLASTIC, QFP-52	Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52	Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52	Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52	Telecom Circuit, 1-Func, GAAS, PQFP52, PLASTIC, QFP-52
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	HQFF, QFL52,.75SQ	QFP, QFP52,.68SQ,40	HQFF, QFL52,.75SQ	HQFF, QFL52,.75SQ	HQFF, QFL52,.75SQ	QFP, QFP52,.68SQ,40
Contacts	52	52	52	52	52	52
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-CQFP-F52	S-PQFP-G52	S-CQFP-F52	S-CQFP-F52	S-CQFP-F52	S-PQFP-G52
JESD-609 code	e0	e0	e0	e0	e0	e0
length	19.05 mm	14 mm	19.05 mm	19.05 mm	19.05 mm	14 mm
Negative supply voltage rating	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V
Number of functions	1	1	1	1	1	1
Number of terminals	52	52	52	52	52	52
Maximum operating temperature	85 °C	85 °C	85 °C	70 °C	70 °C	85 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	HQFF	QFP	HQFF	HQFF	HQFF	QFP
Encapsulate equivalent code	QFL52,.75SQ	QFP52,.68SQ,40	QFL52,.75SQ	QFL52,.75SQ	QFL52,.75SQ	QFP52,.68SQ,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG	FLATPACK	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3 mm	2.35 mm	3 mm	3 mm	3 mm	2.35 mm
Maximum slew rate	0.52 mA	0.52 mA	0.45 mA	0.52 mA	0.45 mA	0.45 mA
surface mount	YES	YES	YES	YES	YES	YES
technology	GAAS	GAAS	GAAS	GAAS	GAAS	GAAS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	OTHER	INDUSTRIAL	COMMERCIAL	COMMERCIAL	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	GULL WING	FLAT	FLAT	FLAT	GULL WING
Terminal pitch	1.27 mm	1 mm	1.27 mm	1.27 mm	1.27 mm	1 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	19.05 mm	14 mm	19.05 mm	19.05 mm	19.05 mm	14 mm

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