IS67WVH16M8ALL-133BLA2 datasheet, PDF

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IS67WVH16M8ALL-133BLA2: DescriptionPseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25; Categorystorage storage; File Size3MB，44 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS67WVH16M8ALL-133BLA2 Overview

Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25

IS67WVH16M8ALL-133BLA2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
package instruction	TBGA, BGA25,5X5,40
Reach Compliance Code	compli
Maximum access time	36 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B25
length	8 mm
memory density	134217728 bi
Memory IC Type	PSEUDO STATIC RAM
memory width	8
Number of functions	1
Number of terminals	25
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
organize	16MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA25,5X5,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
power supply	1.8 V
Certification status	Not Qualified
Filter level	AEC-Q100
Maximum seat height	1.2 mm
Maximum standby current	0.00002 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	6 mm

IS67WVH16M8ALL-133BLA2 Related Products

	IS67WVH16M8ALL-133BLA2	IS66WVH16M8ALL-133B1LE	IS66WVH16M8ALL-133BLE	IS66WVH16M8ALL-133BLI	IS66WVH16M8ALL-166B1LE	IS66WVH16M8ALL-166BLE	IS66WVH16M8ALL-166BLI	IS67WVH16M8ALL-133BLA1	IS67WVH16M8ALL-166BLA1	IS67WVH16M8ALL-166BLA2
Description	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-24	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-24	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25	Pseudo Static RAM, 16MX8, 36ns, CMOS, PBGA25, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-25
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
package instruction	TBGA, BGA25,5X5,40	TBGA, BGA24,5X5,40	TBGA, BGA25,5X5,40	TBGA, BGA25,5X5,40	TBGA, BGA24,5X5,40	TBGA, BGA25,5X5,40	TBGA, BGA25,5X5,40	TBGA, BGA25,5X5,40	TBGA, BGA25,5X5,40	TBGA, BGA25,5X5,40
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli	compli	compli
Maximum access time	36 ns	36 ns	36 ns	36 ns	36 ns	36 ns	36 ns	36 ns	36 ns	36 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B25	R-PBGA-B24	R-PBGA-B25	R-PBGA-B25	R-PBGA-B24	R-PBGA-B25	R-PBGA-B25	R-PBGA-B25	R-PBGA-B25	R-PBGA-B25
length	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm
memory density	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	25	24	25	25	24	25	25	25	25	25
word count	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	105 °C	105 °C	105 °C	85 °C	105 °C	105 °C	85 °C	85 °C	85 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TBGA	TBGA	TBGA	TBGA	TBGA	TBGA	TBGA	TBGA	TBGA	TBGA
Encapsulate equivalent code	BGA25,5X5,40	BGA24,5X5,40	BGA25,5X5,40	BGA25,5X5,40	BGA24,5X5,40	BGA25,5X5,40	BGA25,5X5,40	BGA25,5X5,40	BGA25,5X5,40	BGA25,5X5,40
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum standby current	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm

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