MLL1.4KESD110CAE3 datasheet, PDF

Datasheet> All Categories > Discrete semiconductor> diode> MLL1.4KESD110CAE3

MLL1.4KESD110CAE3: DescriptionTrans Voltage Suppressor Diode, 400W, 110V V(RWM), Bidirectional, 1 Element, Silicon, DO-213AA, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2; CategoryDiscrete semiconductor diode; File Size211KB，4 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

Download Datasheet Parametric View All

MLL1.4KESD110CAE3 Overview

Trans Voltage Suppressor Diode, 400W, 110V V(RWM), Bidirectional, 1 Element, Silicon, DO-213AA, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2

MLL1.4KESD110CAE3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	DO-213AA
package instruction	O-LELF-R2
Contacts	2
Reach Compliance Code	compli
ECCN code	EAR99
Minimum breakdown voltage	122 V
Shell connection	ISOLATED
Maximum clamping voltage	213.3 V
Configuration	SINGLE
Diode component materials	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 code	DO-213AA
JESD-30 code	O-LELF-R2
JESD-609 code	e3
Maximum non-repetitive peak reverse power dissipation	400 W
Number of components	1
Number of terminals	2
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	BIDIRECTIONAL
Maximum power dissipation	0.5 W
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	110 V
surface mount	YES
technology	AVALANCHE
Terminal surface	MATTE TIN
Terminal form	WRAP AROUND
Terminal location	END
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

Preview

Download Datasheet

View All

MLL1.4KESD5.0 thru MLL1.4KESD170CA, e3

SURFACE MOUNT TVS

SCOTTSDALE DIVISION

DESCRIPTION

These small surface mount TVS devices feature the ability to clamp

dangerous high voltage short-term transients such as produced by directed

or radiated electrostatic discharge phenomena before entering sensitive

component regions of a circuit design. They are small economical transient

voltage suppressors targeted primarily for short-term transients below a few

microseconds while still achieving significant peak-pulse-power capability

as illustrated in Figure #1.

APPEARANCE

WWW .

Microsemi

DO-213AA

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

FEATURES

•

Excellent protection in clamping direct ESD level

transients in excess of 15,000 V per MIL-STD-750,

Method 1020 (approx. 150 ns exponential wave)

•

Absorbs ESD level transients* of 1400 Watts per MIL-

STD-750, Method 1020 (approx. 150 ns exponential

wave, or one microsecond transients up to 400 watts.

See Figure #1 and #2 for overall transient Peak Pulse

Power.

•

Clamps Transients in less than 100 picoseconds

•

Working Stand-off Voltage range of 5 V to 170 V

•

Hermetic DO-213AA Package. Also available in axial-

leaded DO-35 package (see separate data sheet for

1.4KESD5.0 series)

•

RoHS Compliant devices available by adding “e3” sufffix

APPLICATIONS / BENEFITS

•

Protects Sensitive circuits from short duration fast

rise time transients such as Electrostatic Discharge

(ESD) or Electrical Fast Transients (EFT)

•

Low inherent capacitance for high-frequency

applications (See Figure #4)

•

Small surface mount foot print

•

Bidirectional features available by adding a “C” or

“CA” suffix

MAXIMUM RATINGS

•

400 Watts for One Microsecond Square Wave or

1400 watts per ESD Wave form of MIL-STD-750,

method 1020

•

See Surge Rating curves in Figures #1, 2 and 3

•

Operating and storage temperature –65

C to 175

•

THERMAL RESISTANCE: 150

C/W junction to end

cap

•

DC power dissipation 500 mW at T

≤

100

•

Derate at 2.3 W/

C above 25

C for P

(1μs) and at

6.67 mW/ C above 100 C for dc power

•

Forward Surge Current 50 amps for 1μs at T

= 25 C

(rise time > 100 ns)

MECHANICAL AND PACKAGING

•

CASE: Hermetically sealed glass DO-213AA surface

mount package

•

FINISH: Tin-lead or RoHS compliant matte-Tin

plating solderable per MIL-STD-750, method 2026

•

POLARITY: Banded end is cathode

•

WEIGHT: 0.04 grams (typical)

•

MARKING: Cathode band only

•

TAPE & REEL option: Standard per EIA-481-B (add

“TR” suffix to part number)

•

See package dimension on last page

1.4KESD5.0

1.4KESD170A, e3

2006

3-29-2006 REV B

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

Recommended Resources

Dual power supply tube power amplifier circuit

Yinhuang A-888 amplifier karaoke circuit diagram

Transistor electronic relay circuit diagram controlling base

LT1111 working principle diagram (b)

Linear amplifier made with CMOS inverter

High fidelity wireless stereo speaker circuit diagram pin function diagram

Does TMS320C6748 support TFTP instance in stareware?: Is there any code or example that supports TFTP in stareware? Can this method be implemented? In the development board demo, there are: ENET_HTTPD, ENET_ECHO, ENET_HTTPD_rmii. Can I find relevant code...; Aguilera DSP and ARM Processors

Low-level error "while(__HAL_RCC_GET_FLAG(RCC_FLAG_HSIRDY) == RESET)" infinite loop: STM32 uses an internal oscillator. When debugging the code that used to work, I found that it always died in the HAL_RCC_OscConfig function of the stm32f0xx_hal_rcc.c file. The following code was repe...; littleshrimp stm32/stm8

I am a DSP novice and have a few questions. I hope the experts can answer them. Thank you!: Question 1: When performing trigonometric operations, which method is faster? I am currently using cossp in c67fastMath downloaded from the official website, but the time it takes is about six times t...; Aguilera DSP and ARM Processors

[Modelsim FAQ] How to add submodule signals to the waveform window for observation: When debugging, you often need to check some signals inside the module under test or even the signals inside multiple submodules instantiated in the module under test to find the cause of the problem....; 小梅哥 Altera SoC

[RVB2601 Creative Application Development] 1. Unboxing and Environment Construction: There is nothing much to say about the unboxing. It is a paper box, two micro data cables and a development board. There is a voice broadcast when it is powered on. The screen is quite beautiful.My co...; shileiwu0505 XuanTie RISC-V Activity Zone

[TI Recommended Course] #[High Precision Lab] Operational Amplifier: 8 Noise#: //training.eeworld.com.cn/TI/show/course/1944...; 54chenjq TI Technology Forum

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components