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S71GL128PC0HH30Y3

Description
Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84
Categorystorage    storage   
File Size391KB,10 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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S71GL128PC0HH30Y3 Overview

Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84

S71GL128PC0HH30Y3 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA,
Contacts84
Reach Compliance Codeunknow
JESD-30 codeR-PBGA-B84
length11.6 mm
memory density134217728 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals84
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.1 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm

S71GL128PC0HH30Y3 Related Products

S71GL128PC0HH30Y3 S71GL128PC0HH31Y2 S71GL128PC0HH31Y3 S71GL128PC0HH31Y0 S71GL128PC0HH30Y0 S71GL128PC0HH30Y2
Description Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction TFBGA, TFBGA, TFBGA, TFBGA, TFBGA, TFBGA,
Contacts 84 84 84 84 84 84
Reach Compliance Code unknow unknown unknown unknown unknown unknow
JESD-30 code R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84
length 11.6 mm 11.6 mm 11.6 mm 11.6 mm 11.6 mm 11.6 mm
memory density 134217728 bi 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bi
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1
Number of terminals 84 84 84 84 84 84
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C
organize 8MX16 8MX16 8MX16 8MX16 8MX16 8MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.1 V 3.1 V 3.1 V 3.1 V 3.1 V 3.1 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER OTHER OTHER
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm

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