Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SPANSION |
Parts packaging code | BGA |
package instruction | TFBGA, |
Contacts | 84 |
Reach Compliance Code | unknown |
JESD-30 code | R-PBGA-B84 |
length | 11.6 mm |
memory density | 134217728 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 84 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 8MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 3.1 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
width | 8 mm |
S71GL128PC0HH31Y3 | S71GL128PC0HH31Y2 | S71GL128PC0HH31Y0 | S71GL128PC0HH30Y0 | S71GL128PC0HH30Y2 | S71GL128PC0HH30Y3 | |
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Description | Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
Maker | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | TFBGA, | TFBGA, | TFBGA, | TFBGA, | TFBGA, | TFBGA, |
Contacts | 84 | 84 | 84 | 84 | 84 | 84 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow |
JESD-30 code | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 |
length | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm |
memory density | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bi | 134217728 bi |
Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
memory width | 16 | 16 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 84 | 84 | 84 | 84 | 84 | 84 |
word count | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
character code | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
organize | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8MX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
Maximum supply voltage (Vsup) | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
width | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |