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MH4S72CMD-12

Description
Synchronous DRAM Module, 4MX72, 8ns, CMOS, DIMM-168
Categorystorage    storage   
File Size691KB,47 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric Compare View All

MH4S72CMD-12 Overview

Synchronous DRAM Module, 4MX72, 8ns, CMOS, DIMM-168

MH4S72CMD-12 Parametric

Parameter NameAttribute value
MakerMitsubishi
Parts packaging codeDIMM
package instructionDIMM, DIMM168
Contacts168
Reach Compliance Codeunknow
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Maximum access time8 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)83 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density301989888 bi
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals168
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX72
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
self refreshYES
Maximum standby current0.036 A
Minimum standby current3 V
Maximum slew rate1.08 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL

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Description Synchronous DRAM Module, 4MX72, 8ns, CMOS, DIMM-168 Synchronous DRAM Module, 4MX72, 9ns, CMOS, DIMM-168 Synchronous DRAM Module, 4MX72, 8ns, CMOS, DIMM-168 Synchronous DRAM Module, 4MX72, 8ns, CMOS, DIMM-168 Synchronous DRAM Module, 4MX72, 9ns, CMOS, DIMM-168 Synchronous DRAM Module, 4MX72, 8ns, CMOS, DIMM-168
Maker Mitsubishi Mitsubishi Mitsubishi Mitsubishi Mitsubishi Mitsubishi
Parts packaging code DIMM DIMM DIMM DIMM DIMM DIMM
Contacts 168 168 168 168 168 168
Reach Compliance Code unknow unknown unknown unknown unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 8 ns 9 ns 8 ns 8 ns 9 ns 8 ns
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 301989888 bi 301989888 bit 301989888 bit 301989888 bit 301989888 bi 301989888 bi
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 72 72 72 72 72 72
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 168 168 168 168 168 168
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX72 4MX72 4MX72 4MX72 4MX72 4MX72
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
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