EEWORLDEEWORLDEEWORLD

Part Number

Search

IM02EB560F

Description
General Purpose Inductor, 56uH, 1%, Ferrite-Core,
CategoryPassive components    inductor   
File Size83KB,7 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

IM02EB560F Overview

General Purpose Inductor, 56uH, 1%, Ferrite-Core,

IM02EB560F Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerVishay
Reach Compliance Codeunknown
ECCN codeEAR99
IM
www.vishay.com
Vishay Dale
Inductors, Commercial, Molded, Axial Leaded
FEATURES
ELECTRICAL SPECIFICATIONS
Inductance Tolerance:
± 1 %, ± 3 %, ± 5 %, ± 10 %,
± 20 %, other tolerances available on request
Insulation Resistance:
1000 M minimum per
MIL-STD-202, method 302, test condition B
Dielectric Strength:
Per MIL-STD-202, method 301:
1000 V
AC
for IM-2, IM-4, IM-6, IM-8, IM-9 and IM-10
200 V
AC
for IM-1
• Wide inductance range in small package
• Flame retardant coating
• Precision performance, excellent reliability,
sturdy construction
• Epoxy molded construction provides superior
moisture protection
• Compliant to RoHS Directive 2011/65/EU
MECHANICAL SPECIFICATIONS
Terminal Strength:
Per MIL-STD-202, method 211, test
condition A: For IM-1, 3 lb pull; for IM-2, IM-4, IM-6, IM-8,
IM-9 and IM-10, 5 lb pull and twist
Weight:
IM-1 = 0.25 g maximum, IM-2 = 0.30 g maximum,
IM-4 = 0.65 g maximum, IM-6 = 0.95 g maximum,
IM-8 = 1.5 g maximum, IM-9 = 2.0 g maximum,
IM-10 = 2.5 g maximum
TEST EQUIPMENT
(1)
• H/P 4342A Q-meter
• Measurements corporation megacycle meter, model 59
• Wheatstone bridge
Note
(1)
Test procedure per MIL-PRF-15305
MATERIAL SPECIFICATIONS
Encapsulant:
Epoxy
Standard Terminals:
IM-1 and IM-2: 24 AWG; IM-4, IM-6
and IM-9: 22 AWG; IM-8: 21 AWG; IM-10: 20 AWG, tinned
copper
INDUCTANCE RANGE AND MILITARY STANDARD
MODEL
IM-1
IM-2
INDUCTANCE RANGE (μH)
MIN.
MAX.
0.10
100
0.022
0.082
0.10
1
1.2
27
33
1000
0.15
4.7
5.6
33
36
240
270
1800
0.10
2.7
3.3
27
33
220
270
1000
1100
3600
68
150
3900
10 000
ENVIRONMENTAL PERFORMANCE
TEST
CONDITIONS
SPECIFICATIONS
Barometric
C
MIL-STD-202, method 105
Pressure
Thermal Shock
A-1
MIL-STD-202, method 107
Flammability
-
MIL-STD-202, method 111
Overload
-
MIL-PRF-15305
Low Temperature
-
MIL-PRF-15305
Storage
Resistance to
A
MIL-STD-202, method 210
Soldering Heat
Resistance to
-
MIL-STD-202, method 215
Solvents
IM-4
IM-6
IM-8
IM-9
IM-10
DIMENSIONS
in inches [millimeters]
C
Typ.
D Dia.
B
A Dia.
MODEL
IM-1
IM-2
IM-4
IM-6
IM-8
IM-9
IM-10
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
A (DIA.)
0.086 [2.18]
0.070 [1.78]
0.105 [2.67]
0.085 [2.16]
0.165 [4.19]
0.145 [3.68]
0.200 [5.08]
0.180 [4.57]
0.225 [5.72]
0.205 [5.21]
0.260 [6.60]
0.240 [6.10]
0.250 [6.35]
0.230 [5.84]
B
0.210 [5.33]
0.190 [4.83]
0.260 [6.60]
0.240 [6.10]
0.385 [9.78]
0.365 [9.27]
0.450 [11.43]
0.430 [10.92]
0.570 [14.48]
0.550 [13.97]
0.570 [14.48]
0.550 [13.97]
0.750 [19.05]
0.730 [18.54]
C (TYP.)
1.62 [41.15]
1.38 [35.05]
1.63 [41.40]
1.25 [31.75]
1.63 [41.40]
1.25 [31.75]
1.63 [41.40]
1.25 [31.75]
1.63 [41.40]
1.25 [31.75]
1.63 [41.40]
1.25 [31.75]
1.63 [41.40]
1.25 [31.75]
D (DIA.)
0.0215 [0.546]
0.0185 [0.470]
0.0215 [0.546]
0.0185 [0.470]
0.027 [0.686]
0.023 [0.584]
0.027 [0.686]
0.023 [0.584]
0.030 [0.762]
0.026 [0.660]
0.027 [0.686]
0.023 [0.584]
0.034 [0.864]
0.030 [0.762]
Revision: 28-Aug-13
Document Number: 34030
1
For technical questions, contact:
magnetics@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Why does the STACK MODE of almost all pads in ALTIUM DESIGNER change to FULL STACK?
It used to work fine before, but I don't know since when, all the multi-layer pads in the PCB library became FULL STACK, resulting in a pad on the top layer and a hole on the bottom layer. I checked o...
littleshrimp PCB Design
[Gizwits Gokit3 Review] + AirLink configuration (Arduino)
We all know that projects that are not connected to the Internet often no longer exist in today's smart home industry, so we must first configure the network for the development board. The specific pr...
跋扈洋 Domestic Chip Exchange
Node voltage calculation
Node voltage calculation【(V1-Vin-)/600】=【(Vin--V2)(600+10.2)】 【(V1-Vin+)/(600+10.2)】=【(Vin+-V2)/600】 By finding the values of Vin- and Vin+ respectively, we can get the sum of Vin- and Vin+,provided t...
QWE4562009 Test/Measurement
Showing goods + artificial intelligence first board dog bone AI
Participate in the new board, dog boardAt present, this is the first board of artificial intelligence. It is a development board focusing on AI from TI, and it is also the only mass-produced developme...
北方 Special Edition for Assessment Centres
CC2640 BLE Bluetooth wireless module low power consumption
1. Product Description   CC2640R2TR2.4-GC is a small-volume SMD BLE4.2 or BLE5.0 Bluetooth wireless module independently developed based on the Texas Instruments (TI) chip CC2640R2 (7mm*7mm), with a b...
Jacktang Wireless Connectivity
pyESP32 board design draft and BOM list
[i=s]This post was last edited by dcexpert on 2020-2-13 15:02[/i]This is a preliminary design, yet to be checked and verified. The complete design file will be shared on github later.3D simulation dia...
dcexpert MicroPython Open Source section

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号