DS8314L-RRX+ datasheet, PDF - EEWORLD Datasheet

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DS8314L-RRX+: DescriptionSmart Card Interface; CategoryThe embedded processor and controller Microcontrollers and processors; File Size259KB，18 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html; Environmental Compliance

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DS8314L-RRX+ Overview

Smart Card Interface

DS8314L-RRX+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	SOIC
package instruction	SOP, SOP28,.4
Contacts	28
Reach Compliance Code	compli
JESD-30 code	R-PDSO-G28
length	17.9 mm
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP28,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3,5 V
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum slew rate	85 mA
Maximum supply voltage	6 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.5 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

DS8314L-RRX+ Related Products

	DS8314L-RRX+	DS8313	DS8313L-RRX+	DS8314	DS8314-RRX+	DS8313-RJX+
Description	Smart Card Interface	Smart Card Interface	Smart Card Interface	Smart Card Interface	Smart Card Interface	IC INTERFACE SMART CARD 28-TSSOP
Is it Rohs certified?	conform to	-	conform to	-	conform to	conform to
Parts packaging code	SOIC	-	SOIC	-	SOIC	SSOP
package instruction	SOP, SOP28,.4	-	SOP, SOP28,.4	-	SOP, SOP28,.4	TSSOP, TSSOP28,.25
Contacts	28	-	28	-	28	28
Reach Compliance Code	compli	-	compli	-	compliant	unknown
JESD-30 code	R-PDSO-G28	-	R-PDSO-G28	-	R-PDSO-G28	R-PDSO-G28
length	17.9 mm	-	17.9 mm	-	17.9 mm	9.7 mm
Number of terminals	28	-	28	-	28	28
Maximum operating temperature	85 °C	-	85 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	-	SOP	-	SOP	TSSOP
Encapsulate equivalent code	SOP28,.4	-	SOP28,.4	-	SOP28,.4	TSSOP28,.25
Package shape	RECTANGULAR	-	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3,5 V	-	3.3,5 V	-	3.3,5 V	3.3,5 V
Certification status	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	-	2.65 mm	-	2.65 mm	1.1 mm
Maximum slew rate	85 mA	-	85 mA	-	85 mA	85 mA
Maximum supply voltage	6 V	-	6 V	-	6 V	6 V
Minimum supply voltage	2.7 V	-	2.7 V	-	2.7 V	2.7 V
Nominal supply voltage	3.3 V	-	3.3 V	-	3.3 V	3.3 V
surface mount	YES	-	YES	-	YES	YES
technology	CMOS	-	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	-	GULL WING	-	GULL WING	GULL WING
Terminal pitch	1.27 mm	-	1.27 mm	-	1.27 mm	0.65 mm
Terminal location	DUAL	-	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	7.5 mm	-	7.5 mm	-	7.5 mm	4.4 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	-	MICROPROCESSOR CIRCUIT	-	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Base Number Matches	1	-	1	-	1	1

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