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DS8314-RRX+

Description
Smart Card Interface
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size259KB,18 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Environmental Compliance
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DS8314-RRX+ Overview

Smart Card Interface

DS8314-RRX+ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMaxim
Parts packaging codeSOIC
package instructionSOP, SOP28,.4
Contacts28
Reach Compliance Codecompliant
JESD-30 codeR-PDSO-G28
length17.9 mm
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3,5 V
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum slew rate85 mA
Maximum supply voltage6 V
Minimum supply voltage2.7 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.5 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
Base Number Matches1

DS8314-RRX+ Related Products

DS8314-RRX+ DS8313 DS8313L-RRX+ DS8314 DS8314L-RRX+ DS8313-RJX+
Description Smart Card Interface Smart Card Interface Smart Card Interface Smart Card Interface Smart Card Interface IC INTERFACE SMART CARD 28-TSSOP
Is it Rohs certified? conform to - conform to - conform to conform to
Parts packaging code SOIC - SOIC - SOIC SSOP
package instruction SOP, SOP28,.4 - SOP, SOP28,.4 - SOP, SOP28,.4 TSSOP, TSSOP28,.25
Contacts 28 - 28 - 28 28
Reach Compliance Code compliant - compli - compli unknown
JESD-30 code R-PDSO-G28 - R-PDSO-G28 - R-PDSO-G28 R-PDSO-G28
length 17.9 mm - 17.9 mm - 17.9 mm 9.7 mm
Number of terminals 28 - 28 - 28 28
Maximum operating temperature 85 °C - 85 °C - 85 °C 85 °C
Minimum operating temperature -40 °C - -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP - SOP - SOP TSSOP
Encapsulate equivalent code SOP28,.4 - SOP28,.4 - SOP28,.4 TSSOP28,.25
Package shape RECTANGULAR - RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 3.3,5 V - 3.3,5 V - 3.3,5 V 3.3,5 V
Certification status Not Qualified - Not Qualified - Not Qualified Not Qualified
Maximum seat height 2.65 mm - 2.65 mm - 2.65 mm 1.1 mm
Maximum slew rate 85 mA - 85 mA - 85 mA 85 mA
Maximum supply voltage 6 V - 6 V - 6 V 6 V
Minimum supply voltage 2.7 V - 2.7 V - 2.7 V 2.7 V
Nominal supply voltage 3.3 V - 3.3 V - 3.3 V 3.3 V
surface mount YES - YES - YES YES
technology CMOS - CMOS - CMOS CMOS
Temperature level INDUSTRIAL - INDUSTRIAL - INDUSTRIAL INDUSTRIAL
Terminal form GULL WING - GULL WING - GULL WING GULL WING
Terminal pitch 1.27 mm - 1.27 mm - 1.27 mm 0.65 mm
Terminal location DUAL - DUAL - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 7.5 mm - 7.5 mm - 7.5 mm 4.4 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT - MICROPROCESSOR CIRCUIT - MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Base Number Matches 1 - 1 - 1 1

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