AS7C332MFT18A-75TQC datasheet, PDF

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AS7C332MFT18A-75TQC: Description3.3V 2M x 18 Flow-through synchronous SRAM; Categorystorage storage; File Size495KB，19 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS7C332MFT18A-75TQC Overview

3.3V 2M x 18 Flow-through synchronous SRAM

AS7C332MFT18A-75TQC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	7.5 ns
Other features	FLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)	117.64 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	37748736 bi
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of terminals	100
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.1 A
Minimum standby current	3.14 V
Maximum slew rate	0.29 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

AS7C332MFT18A-75TQC Related Products

	AS7C332MFT18A-75TQC	AS7C332MFT18A	AS7C332MFT18A-10TQI	AS7C332MFT18A-10TQIN	AS7C332MFT18A-75TQCN	AS7C332MFT18A-75TQI	AS7C332MFT18A-75TQIN	AS7C332MFT18A-85TQCN	AS7C332MFT18A-85TQC	AS7C332MFT18A-85TQI
Description	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM	3.3V 2M x 18 Flow-through synchronous SRAM
Is it Rohs certified?	incompatible	-	incompatible	conform to	conform to	incompatible	conform to	conform to	incompatible	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP	-	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	LQFP, QFP100,.63X.87	-	LQFP,	LQFP,	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	100	-	100	100	100	100	100	100	100	100
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	7.5 ns	-	10 ns	10 ns	7.5 ns	7.5 ns	7.5 ns	8.5 ns	8.5 ns	8.5 ns
Other features	FLOW-THROUGH ARCHITECTURE	-	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)	117.64 MHz	-	-	-	117.64 MHz	117.64 MHz	117.64 MHz	100 MHz	100 MHz	100 MHz
I/O type	COMMON	-	-	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	-	e0	e3	e3	e0	e3	e3	e0	e0
length	20 mm	-	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
memory density	37748736 bi	-	37748736 bi	37748736 bi	37748736 bi	37748736 bi	37748736 bi	37748736 bi	37748736 bi	37748736 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	18	-	18	18	18	18	18	18	18	18
Number of functions	1	-	1	1	1	1	1	1	1	1
Number of terminals	100	-	100	100	100	100	100	100	100	100
word count	2097152 words	-	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	-	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	85 °C	85 °C	70 °C	85 °C	85 °C	70 °C	70 °C	85 °C
organize	2MX18	-	2MX18	2MX18	2MX18	2MX18	2MX18	2MX18	2MX18	2MX18
Output characteristics	3-STATE	-	-	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	-	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	QFP100,.63X.87	-	-	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	245	245	NOT SPECIFIED	245	245	NOT SPECIFIED	NOT SPECIFIED
power supply	2.5/3.3,3.3 V	-	-	-	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.1 A	-	-	-	0.1 A	0.1 A	0.1 A	0.1 A	0.1 A	0.1 A
Minimum standby current	3.14 V	-	-	-	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.29 mA	-	-	-	0.29 mA	0.29 mA	0.29 mA	0.27 mA	0.27 mA	0.27 mA
Maximum supply voltage (Vsup)	3.465 V	-	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	-	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	-	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	TIN LEAD	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	-	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	30	30	NOT SPECIFIED	30	30	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	-	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

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