MCP2021A-330E/SL datasheet, PDF

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MCP2021A-330E/SL: DescriptionDATACOM, INTERFACE CIRCUIT; CategoryWireless rf/communication Telecom circuit; ManufacturerMicrochip; Websitehttps://www.microchip.com

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MCP2021A-330E/SL Overview

DATACOM, INTERFACE CIRCUIT

MCP2021A-330E/SL Parametric

Parameter Name	Attribute value
Maker	Microchip
package instruction	SOIC-14
Reach Compliance Code	compliant
JESD-30 code	R-PDSO-G14
length	8.65 mm
Number of functions	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Filter level	TS 16949
Maximum seat height	1.75 mm
surface mount	YES
Telecom integrated circuit types	INTERFACE CIRCUIT
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	3.9 mm

MCP2021A-330E/SL Related Products

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Description	DATACOM, INTERFACE CIRCUIT	DATACOM, INTERFACE CIRCUIT	DATACOM, INTERFACE CIRCUIT	lin transceivers lin transceiver + 3.3V ldo	lin transceivers lin transceiver + 5.0V ldo	lin transceivers lin transceiver + 5.0V ldo	DATACOM, INTERFACE CIRCUIT	DATACOM, INTERFACE CIRCUIT	DATACOM, INTERFACE CIRCUIT
package instruction	SOIC-14	SOP,	SOIC-14	SOP,	SOP,	TSSOP,	TSSOP-14	SOIC-14	SOIC-14
Reach Compliance Code	compliant	compli	compli	compli	compli	compliant	compliant	compliant	compliant
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14
length	8.65 mm	8.65 mm	8.65 mm	8.65 mm	8.65 mm	5 mm	8.65 mm	8.65 mm	8.65 mm
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	14	14	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SOP	SOP	SOP	TSSOP	SOP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Filter level	TS 16949	TS 16949	TS 16949	TS 16949	TS 16949	TS 16949	TS 16949	TS 16949	TS 16949
Maximum seat height	1.75 mm	1.75 mm	1.75 mm	1.75 mm	1.75 mm	1.2 mm	1.75 mm	1.75 mm	1.75 mm
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
Telecom integrated circuit types	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	3.9 mm	3.9 mm	3.9 mm	3.9 mm	3.9 mm	4.4 mm	3.9 mm	3.9 mm	3.9 mm
Nominal supply voltage	-	7.3 V	-	3.3 V	5 V	5 V	7.3 V	-	-
Base Number Matches	-	1	1	1	1	1	-	-	-

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