DATACOM, INTERFACE CIRCUIT
| Parameter Name | Attribute value |
| package instruction | SOP, |
| Reach Compliance Code | compli |
| JESD-30 code | R-PDSO-G14 |
| length | 8.65 mm |
| Number of functions | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Filter level | TS 16949 |
| Maximum seat height | 1.75 mm |
| Nominal supply voltage | 7.3 V |
| surface mount | YES |
| Telecom integrated circuit types | INTERFACE CIRCUIT |
| Temperature level | AUTOMOTIVE |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 3.9 mm |
| Base Number Matches | 1 |
| MCP2021A-500E/ST | MCP2021A-500E/SL | MCP2022A-330E/SL | MCP2022A-500E/SL | MCP2022A-500E/ST | MCP2021A-330E/SL | MCP2021A-330E/ST | MCP2021AT-330E/SL | MCP2021AT-500E/SL | |
|---|---|---|---|---|---|---|---|---|---|
| Description | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT | lin transceivers lin transceiver + 3.3V ldo | lin transceivers lin transceiver + 5.0V ldo | lin transceivers lin transceiver + 5.0V ldo | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT |
| package instruction | SOP, | SOIC-14 | SOP, | SOP, | TSSOP, | SOIC-14 | TSSOP-14 | SOIC-14 | SOIC-14 |
| Reach Compliance Code | compli | compli | compli | compli | compliant | compliant | compliant | compliant | compliant |
| JESD-30 code | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| length | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 5 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | SOP | TSSOP | SOP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Filter level | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 |
| Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.2 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| Telecom integrated circuit types | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 4.4 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Nominal supply voltage | 7.3 V | - | 3.3 V | 5 V | 5 V | - | 7.3 V | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD