FM25H20-G datasheet, PDF - EEWORLD Datasheet

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FM25H20-G: DescriptionSPECIALTY MEMORY CIRCUIT, PDSO8; Categorystorage storage; File Size333KB，15 Pages; ManufacturerRamtron International Corporation (Cypress Semiconductor Corporation); Websitehttp://www.cypress.com/

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FM25H20-G Overview

SPECIALTY MEMORY CIRCUIT, PDSO8

FM25H20-G Parametric

Parameter Name	Attribute value
Maker	Ramtron International Corporation (Cypress Semiconductor Corporation)
Parts packaging code	SOIC
package instruction	HVSON,
Contacts	8
Reach Compliance Code	unknow
JESD-30 code	R-PDSO-G8
length	6 mm
memory density	2097152 bi
Memory IC Type	MEMORY CIRCUIT
memory width	8
Number of functions	1
Number of terminals	8
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
Maximum seat height	0.8 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	5 mm

FM25H20-G Related Products

	FM25H20-G	FM25H20	FM25H20-DG	FM25H20-GTR
Description	SPECIALTY MEMORY CIRCUIT, PDSO8	SPECIALTY MEMORY CIRCUIT, PDSO8	SPECIALTY MEMORY CIRCUIT, PDSO8	SPECIALTY MEMORY CIRCUIT, PDSO8
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
Maximum operating temperature	85 °C	85 Cel	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 Cel	-40 °C	-40 °C
organize	256KX8	256K × 8	256KX8	256KX8
surface mount	YES	Yes	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	NO	NO LEAD	GULL WING
Terminal location	DUAL	pair	DUAL	DUAL
Maker	Ramtron International Corporation (Cypress Semiconductor Corporation)	-	Ramtron International Corporation (Cypress Semiconductor Corporation)	Ramtron International Corporation (Cypress Semiconductor Corporation)
Parts packaging code	SOIC	-	DFN	SOIC
package instruction	HVSON,	-	HVSON,	SOP,
Contacts	8	-	8	8
Reach Compliance Code	unknow	-	unknow	unknow
JESD-30 code	R-PDSO-G8	-	R-PDSO-N8	R-PDSO-G8
length	6 mm	-	6 mm	5.28 mm
memory density	2097152 bi	-	2097152 bi	2097152 bi
Memory IC Type	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT
word count	262144 words	-	262144 words	262144 words
character code	256000	-	256000	256000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVSON	-	HVSON	SOP
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE
Certification status	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	0.8 mm	-	0.8 mm	2 mm
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V
technology	CMOS	-	CMOS	CMOS
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm
width	5 mm	-	5 mm	5.23 mm

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