FM25H20 datasheet, PDF - EEWORLD Datasheet

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FM25H20: DescriptionSPECIALTY MEMORY CIRCUIT, PDSO8; Categorystorage; File Size333KB，15 Pages; ManufacturerRamtron International Corporation (Cypress Semiconductor Corporation); Websitehttp://www.cypress.com/

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FM25H20 Overview

SPECIALTY MEMORY CIRCUIT, PDSO8

FM25H20 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	2.7 V
Rated supply voltage	3.3 V
Processing package description	5 × 6 MM, 1.27 MM PITCH, GREEN, TDFN-8
state	ACTIVE
packaging shape	Rectangle
Package Size	SMALL OUTLINE
surface mount	Yes
Terminal form	NO
Terminal spacing	1.27 mm
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
memory width	8
organize	256K × 8
storage density	2.10E6 deg
operating mode	Synchronize
Number of digits	262144 words
Number of digits	256K
Memory IC type	memory circuit

FM25H20 Related Products

	FM25H20	FM25H20-DG	FM25H20-G	FM25H20-GTR
Description	SPECIALTY MEMORY CIRCUIT, PDSO8	SPECIALTY MEMORY CIRCUIT, PDSO8	SPECIALTY MEMORY CIRCUIT, PDSO8	SPECIALTY MEMORY CIRCUIT, PDSO8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
Maximum operating temperature	85 Cel	85 °C	85 °C	85 °C
Minimum operating temperature	-40 Cel	-40 °C	-40 °C	-40 °C
surface mount	Yes	YES	YES	YES
Terminal form	NO	NO LEAD	GULL WING	GULL WING
Terminal location	pair	DUAL	DUAL	DUAL
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
memory width	8	8	8	8
organize	256K × 8	256KX8	256KX8	256KX8
Maker	-	Ramtron International Corporation (Cypress Semiconductor Corporation)	Ramtron International Corporation (Cypress Semiconductor Corporation)	Ramtron International Corporation (Cypress Semiconductor Corporation)
Parts packaging code	-	DFN	SOIC	SOIC
package instruction	-	HVSON,	HVSON,	SOP,
Contacts	-	8	8	8
Reach Compliance Code	-	unknow	unknow	unknow
JESD-30 code	-	R-PDSO-N8	R-PDSO-G8	R-PDSO-G8
length	-	6 mm	6 mm	5.28 mm
memory density	-	2097152 bi	2097152 bi	2097152 bi
Memory IC Type	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
word count	-	262144 words	262144 words	262144 words
character code	-	256000	256000	256000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	HVSON	HVSON	SOP
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Certification status	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	0.8 mm	0.8 mm	2 mm
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V
technology	-	CMOS	CMOS	CMOS
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm
width	-	5 mm	5 mm	5.23 mm

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