SPECIALTY MEMORY CIRCUIT, PDSO8
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Ramtron International Corporation (Cypress Semiconductor Corporation) |
| Parts packaging code | DFN |
| package instruction | HVSON, |
| Contacts | 8 |
| Reach Compliance Code | unknow |
| JESD-30 code | R-PDSO-N8 |
| length | 6 mm |
| memory density | 2097152 bi |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVSON |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 0.8 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 5 mm |
| FM25H20-DG | FM25H20 | FM25H20-G | FM25H20-GTR | |
|---|---|---|---|---|
| Description | SPECIALTY MEMORY CIRCUIT, PDSO8 | SPECIALTY MEMORY CIRCUIT, PDSO8 | SPECIALTY MEMORY CIRCUIT, PDSO8 | SPECIALTY MEMORY CIRCUIT, PDSO8 |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 85 °C | 85 Cel | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 Cel | -40 °C | -40 °C |
| organize | 256KX8 | 256K × 8 | 256KX8 | 256KX8 |
| surface mount | YES | Yes | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | NO | GULL WING | GULL WING |
| Terminal location | DUAL | pair | DUAL | DUAL |
| Maker | Ramtron International Corporation (Cypress Semiconductor Corporation) | - | Ramtron International Corporation (Cypress Semiconductor Corporation) | Ramtron International Corporation (Cypress Semiconductor Corporation) |
| Parts packaging code | DFN | - | SOIC | SOIC |
| package instruction | HVSON, | - | HVSON, | SOP, |
| Contacts | 8 | - | 8 | 8 |
| Reach Compliance Code | unknow | - | unknow | unknow |
| JESD-30 code | R-PDSO-N8 | - | R-PDSO-G8 | R-PDSO-G8 |
| length | 6 mm | - | 6 mm | 5.28 mm |
| memory density | 2097152 bi | - | 2097152 bi | 2097152 bi |
| Memory IC Type | MEMORY CIRCUIT | - | MEMORY CIRCUIT | MEMORY CIRCUIT |
| word count | 262144 words | - | 262144 words | 262144 words |
| character code | 256000 | - | 256000 | 256000 |
| Operating mode | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVSON | - | HVSON | SOP |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| Maximum seat height | 0.8 mm | - | 0.8 mm | 2 mm |
| Maximum supply voltage (Vsup) | 3.6 V | - | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V | - | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | 3.3 V | - | 3.3 V | 3.3 V |
| technology | CMOS | - | CMOS | CMOS |
| Terminal pitch | 1.27 mm | - | 1.27 mm | 1.27 mm |
| width | 5 mm | - | 5 mm | 5.23 mm |
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