R1171x SERIES
2.0A/1.5A LDO REGULATOR
NO. EA-125-1018
OUTLINE
The R1171x Series are CMOS-based positive voltage regulator ICs. The R1171x Series have features of low
dropout voltage, high output voltage accuracy, low consumption current. Each of these ICs consists of a voltage
reference unit, an error amplifier, resistor net for setting output voltage, a current limit circuit at short mode, a
chip enable circuit, and thermal-shunt circuit. The output voltage of R1171 is fixed in the IC.
Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make
low dropout voltage and chip enable function prolongs the battery life. These regulators are remarkable
improvement on the current regulators in terms of input transient response, and load transient response.
Thus, the R1171x Series are suitable for various power sources.
Since the packages for these ICs are high wattage HSOP-6J package, TO-252-5L (Under Development), high
density mounting of the ICs on boards is possible.
FEATURES
•
Low Supply Current...................................................... Typ. 130µA
•
Low Standby Current.................................................... Typ. 0.1µA
•
Output Current.............................................................. Min. 1.5A (V
IN
=V
OUT
+1.0V,
R1171SxxxA/B)
Min. 2.0A (V
IN
=V
OUT
+1.0V,
R1171JxxxC/D)
(Under Development)
•
Output Voltage.............................................................. Stepwise setting with a step of 0.1V in the range of
1.5V to 5.0V for A/B Versions,
1.8V to 5.0V for C/D Versions.
•
Output Voltage Accuracy ..............................................
±
2.0%
•
Low Dropout Voltage .................................................... Typ. 0.09V (V
OUT
=3.0V,
I
OUT
=300mA)
•
Line Regulation ............................................................ Typ. 0.05%/V
•
Packages...................................................................... HSOP-6J, TO-252-5L (Under Development)
•
Built-in Current Limit Circuit
•
Built-in Thermal Shunt Circuit
•
Low Temperature-drift Coefficient of Output Voltage ... Typ.
±
100ppm/°C
•
Ceramic capacitor for phase compensation................. C
IN
=C
OUT
=Ceramic
10.0µF (V
OUT
<1.8V)
C
IN
=C
OUT
=Ceramic
4.7µF (V
OUT
>
1.8V)
=
APPLICATIONS
•
•
•
•
Local Power source for Notebook PC.
Local Power source for portable appliances, cameras, and videos.
Local Power source for equipment of battery-use.
Local Power source for home appliances.
1
R1171x
SELECTION GUIDE
The output voltage, the chip-enable polarity, the taping type can be selected at the user's request.
The selection can be made with the part number as follows;
R1171xxx1x-xx
←Part
Number
↑ ↑
a b
Code
a
↑
c
↑
d
Contents
Package Type;
S: HSOP-6J
J: TO-252-5L (Under Development)
Designation of Output Voltage (V
OUT
)
Stepwise setting with 0.1V increment in the range from 1.5V to 5.0V(A/B version), from 1.8V
to 5.0V(C/D version: Under Development)
“Exception” 2.85V type: R1171x281x5-xx, 1.85V Type: R1171x181x5
Designation of option;
A: Built-in Chip Enable Circuit, Active at "L" (Output Current: Min. 1.5A)
B: Built-in Chip Enable Circuit, Active at "H" (Output Current: Min.1.5A)
C: Built-in Chip Enable Circuit, Active at “L” (Output Current: Min.2.0A)*Under Development
D: Built-in Chip Enable Circuit, Active at “H” (Output Current: Min.2.0A)*Under Development
Designation of Taping Type;
E2 (HSOP-6J) (Refer to Taping Specifications)
TO-252-5L: unfixed
b
c
d
3
R1171x
PIN CONFIGURATION
z
HSOP-6J
6
5
4
z
TO-252-5L (Under Development)
R
1
2
3
1
2
3
4
5
PIN DESCRIPTION
•
HSOP-6J
Pin No
1
2
3
4
5
Symbol
V
OUT
GND
Description
Voltage Regulator Output Pin
Ground Pin
Chip Enable Pin
No Connection
Ground Pin
•
TO-252-5L (Under Development)
Pin No
1
2
3
4
5
Symbol
V
OUT
Description
Voltage Regulator Output Pin
Chip Enable Pin
Ground Pin
Ground Pin
CE
or CE
GND
GND
V
DD
CE
or CE
NC
GND
Input Pin
6
V
DD
Input Pin
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
Rating
Unit
V
IN
V
CE
V
OUT
I
OUT
P
D
Topt
Tstg
Input Voltage
Input Voltage ( CE or CE Input Pin)
Output Voltage
Output Current
Power Dissipation (HSOP-6J)
∗
Operating Temperature
Storage Temperature
1
∗
1
7.0
−
0.3 ~ V
IN
+
0.3
−
0.3 ~ V
IN
+
0.3
V
V
V
A
mW
°
C
°
C
3.5
1700
Under Development
−
40 ~ 85
−
55 ~ 125
Power Dissipation (TO-252-5L)
∗
1 For Power Dissipation, please refer to PACKAGE INFORMATION to be described.
4
Wireless Connectivity
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