J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, CDIP14
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T14 |
JESD-609 code | e0 |
Logic integrated circuit type | J-K FLIP-FLOP |
MaximumI(ol) | 0.02 A |
Number of functions | 1 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Prop。Delay @ Nom-Sup | 27 ns |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Trigger type | MASTER-SLAVE |
S54H71F/883B | N74H71NB | N74H71A | N74H71FB | N74H71F | S54H71W | S54H71W/883B | S54H71F | S54H71F/883C | |
---|---|---|---|---|---|---|---|---|---|
Description | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, CDIP14 | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, PDIP14 | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, PDIP14 | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, CDIP14 | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, CDIP14 | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, CDFP14 | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, CDFP14 | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, CDIP14 | J-K Flip-Flop, 1-Func, Master-slave Triggered, TTL, CDIP14 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | - | - | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DFP | DFP | DIP | DIP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
surface mount | NO | NO | NO | NO | NO | YES | YES | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Trigger type | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE |
MaximumI(ol) | 0.02 A | - | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
Prop。Delay @ Nom-Sup | 27 ns | - | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns |
Certification status | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |