RS532010E datasheet, PDF - EEWORLD Datasheet

RS532010E: DescriptionMASK ROM, 256KX8, 200ns, CMOS, PDSO32, SOP-32; Categorystorage storage; File Size86KB，4 Pages; ManufacturerRICOH Electronic Devices Co., Ltd.

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RS532010E Overview

MASK ROM, 256KX8, 200ns, CMOS, PDSO32, SOP-32

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	RICOH Electronic Devices Co., Ltd.
Parts packaging code	SOIC
package instruction	SOP,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	200 ns
Other features	POWER-DOWN
JESD-30 code	R-PDSO-G32
memory density	2097152 bit
Memory IC Type	MASK ROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	11.3 mm

	RS532010E	RP532010E
Description	MASK ROM, 256KX8, 200ns, CMOS, PDSO32, SOP-32	MASK ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32
Is it Rohs certified?	incompatible	incompatible
Maker	RICOH Electronic Devices Co., Ltd.	RICOH Electronic Devices Co., Ltd.
Parts packaging code	SOIC	DIP
package instruction	SOP,	DIP,
Contacts	32	32
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	200 ns	200 ns
Other features	POWER-DOWN	POWER-DOWN
JESD-30 code	R-PDSO-G32	R-PDIP-T32
memory density	2097152 bit	2097152 bit
Memory IC Type	MASK ROM	MASK ROM
memory width	8	8
Humidity sensitivity level	1	1
Number of functions	1	1
Number of terminals	32	32
word count	262144 words	262144 words
character code	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	256KX8	256KX8
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL
width	11.3 mm	15.24 mm

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