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RP532010E

Description
MASK ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32
Categorystorage    storage   
File Size86KB,4 Pages
ManufacturerRICOH Electronic Devices Co., Ltd.
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RP532010E Overview

MASK ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32

RP532010E Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRICOH Electronic Devices Co., Ltd.
Parts packaging codeDIP
package instructionDIP,
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
Other featuresPOWER-DOWN
JESD-30 codeR-PDIP-T32
memory density2097152 bit
Memory IC TypeMASK ROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

RP532010E Related Products

RP532010E RS532010E
Description MASK ROM, 256KX8, 200ns, CMOS, PDIP32, DIP-32 MASK ROM, 256KX8, 200ns, CMOS, PDSO32, SOP-32
Is it Rohs certified? incompatible incompatible
Maker RICOH Electronic Devices Co., Ltd. RICOH Electronic Devices Co., Ltd.
Parts packaging code DIP SOIC
package instruction DIP, SOP,
Contacts 32 32
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 200 ns 200 ns
Other features POWER-DOWN POWER-DOWN
JESD-30 code R-PDIP-T32 R-PDSO-G32
memory density 2097152 bit 2097152 bit
Memory IC Type MASK ROM MASK ROM
memory width 8 8
Humidity sensitivity level 1 1
Number of functions 1 1
Number of terminals 32 32
word count 262144 words 262144 words
character code 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 256KX8 256KX8
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Certification status Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 1.27 mm
Terminal location DUAL DUAL
width 15.24 mm 11.3 mm

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