VS8012LI datasheet, PDF - EEWORLD Datasheet

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VS8012LI: DescriptionMux/Demux, 1-Func, GAAS, CQCC52, CAVITY DOWN, HEAT SINK, CERAMIC, LCC-52; CategoryWireless rf/communication Telecom circuit; File Size560KB，17 Pages; ManufacturerVitesse Semiconductor Corporation; Websitehttp://www.vitesse.com/

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VS8012LI Overview

Mux/Demux, 1-Func, GAAS, CQCC52, CAVITY DOWN, HEAT SINK, CERAMIC, LCC-52

VS8012LI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Vitesse Semiconductor Corporation
Parts packaging code	LCC
package instruction	HQCCN, LCC52,.75SQ
Contacts	52
Reach Compliance Code	unknown
app	SONET
JESD-30 code	S-CQCC-N52
JESD-609 code	e0
length	19.05 mm
Negative supply voltage rating	-5.2 V
Number of functions	1
Number of terminals	52
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	HQCCN
Encapsulate equivalent code	LCC52,.75SQ
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	-2,-5.2 V
Certification status	Not Qualified
Maximum seat height	2.79 mm
Maximum slew rate	600 mA
surface mount	YES
technology	GAAS
Telecom integrated circuit types	ATM/SONET/SDH MUX/DEMUX
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	19.05 mm

VS8012LI Related Products

	VS8012LI	VS8011FC	VS8011FI	VS8011LC	VS8011LI	VS8012FC	VS8012FI	VS8012LC
Description	Mux/Demux, 1-Func, GAAS, CQCC52, CAVITY DOWN, HEAT SINK, CERAMIC, LCC-52	Mux/Demux, 1-Func, GAAS, CQFP52, CAVITY DOWN, HEAT SINK, CERAMIC, LDCC-52	Mux/Demux, 1-Func, GAAS, CQFP52, CAVITY DOWN, HEAT SINK, CERAMIC, LDCC-52	Mux/Demux, 1-Func, GAAS, CQCC52, CAVITY DOWN, HEAT SINK, CERAMIC, LCC-52	Mux/Demux, 1-Func, GAAS, CQCC52, CAVITY DOWN, HEAT SINK, CERAMIC, LCC-52	Mux/Demux, 1-Func, GAAS, CQFP52, CAVITY DOWN, HEAT SINK, CERAMIC, LDCC-52	Mux/Demux, 1-Func, GAAS, CQFP52, CAVITY DOWN, HEAT SINK, CERAMIC, LDCC-52	Mux/Demux, 1-Func, GAAS, CQCC52, CAVITY DOWN, HEAT SINK, CERAMIC, LCC-52
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation	Vitesse Semiconductor Corporation
Parts packaging code	LCC	QFP	QFP	LCC	LCC	QFP	QFP	LCC
package instruction	HQCCN, LCC52,.75SQ	QFF, QFL52,.55SQ,40	QFF, QFL52,.55SQ,40	HQCCN, LCC52,.75SQ	HQCCN, LCC52,.75SQ	QFF, QFL52,.55SQ,40	QFF, QFL52,.55SQ,40	HQCCN, LCC52,.75SQ
Contacts	52	52	52	52	52	52	52	52
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
app	SONET	SONET	SONET	SONET	SONET	SONET	SONET	SONET
JESD-30 code	S-CQCC-N52	S-CQFP-F52	S-CQFP-F52	S-CQCC-N52	S-CQCC-N52	S-CQFP-F52	S-CQFP-F52	S-CQCC-N52
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm
Negative supply voltage rating	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	52	52	52	52	52	52	52	52
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	HQCCN	QFF	QFF	HQCCN	HQCCN	QFF	QFF	HQCCN
Encapsulate equivalent code	LCC52,.75SQ	QFL52,.55SQ,40	QFL52,.55SQ,40	LCC52,.75SQ	LCC52,.75SQ	QFL52,.55SQ,40	QFL52,.55SQ,40	LCC52,.75SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG	FLATPACK	FLATPACK	CHIP CARRIER, HEAT SINK/SLUG	CHIP CARRIER, HEAT SINK/SLUG	FLATPACK	FLATPACK	CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V	-2,-5.2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.79 mm	3.03 mm	3.03 mm	2.79 mm	2.79 mm	3.03 mm	3.03 mm	2.79 mm
Maximum slew rate	600 mA	600 mA	600 mA	600 mA	600 mA	600 mA	600 mA	600 mA
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	GAAS	GAAS	GAAS	GAAS	GAAS	GAAS	GAAS	GAAS
Telecom integrated circuit types	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	FLAT	FLAT	NO LEAD	NO LEAD	FLAT	FLAT	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm

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