WPS128K32-15PJC datasheet, PDF

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WPS128K32-15PJC: DescriptionSRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68; Categorystorage storage; File Size733KB，7 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WPS128K32-15PJC Overview

SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68

WPS128K32-15PJC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	PLASTIC, MO-47AE, LCC-68
Reach Compliance Code	unknown
Maximum access time	15 ns
Other features	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX
Spare memory width	16
JESD-30 code	S-PQCC-J68
length	24.2824 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX32
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Maximum seat height	4.572 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	24.2824 mm

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Description	SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 128KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 128KX32, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	PLASTIC, MO-47AE, LCC-68	QCCJ,	QCCJ,	PLASTIC, MO-47AE, LCC-68	PLASTIC, MO-47AE, LCC-68	PLASTIC, MO-47AE, LCC-68	PLASTIC, MO-47AE, LCC-68	PLASTIC, MO-47AE, LCC-68
Reach Compliance Code	unknown	compliant	compliant	unknown	unknown	unknow	unknown	unknown
Maximum access time	15 ns	17 ns	20 ns	25 ns	25 ns	15 ns	12 ns	20 ns
Other features	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX	ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX
Spare memory width	16	16	16	16	16	16	16	16
JESD-30 code	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68
length	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bi	4194304 bit	4194304 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	68	68	68	68	68	68	68	68
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C
organize	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Maximum seat height	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm	24.2824 mm
Maker	Microsemi	Microsemi	-	Microsemi	Microsemi	Microsemi	-	-

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