SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
package instruction | PLASTIC, MO-47AE, LCC-68 |
Reach Compliance Code | unknown |
Maximum access time | 25 ns |
Other features | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX |
Spare memory width | 16 |
JESD-30 code | S-PQCC-J68 |
length | 24.2824 mm |
memory density | 4194304 bit |
Memory IC Type | SRAM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128KX32 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Maximum seat height | 4.572 mm |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
width | 24.2824 mm |
WPS128K32-25PJI | WPS128K32-17PJI | WPS128K32-20PJC | WPS128K32-15PJC | WPS128K32-25PJC | WPS128K32-15PJI | WPS128K32-12PJC | WPS128K32-20PJI | |
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Description | SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | PLASTIC, MO-47AE, LCC-68 | QCCJ, | QCCJ, | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 | PLASTIC, MO-47AE, LCC-68 |
Reach Compliance Code | unknown | compliant | compliant | unknown | unknown | unknow | unknown | unknown |
Maximum access time | 25 ns | 17 ns | 20 ns | 15 ns | 25 ns | 15 ns | 12 ns | 20 ns |
Other features | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX | ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX |
Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
JESD-30 code | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
length | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bi | 4194304 bit | 4194304 bit |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
organize | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Maximum seat height | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
width | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm | 24.2824 mm |
Maker | Microsemi | Microsemi | - | Microsemi | Microsemi | Microsemi | - | - |