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WPS128K32-25PJI

Description
SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
Categorystorage    storage   
File Size733KB,7 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

WPS128K32-25PJI Overview

SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68

WPS128K32-25PJI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionPLASTIC, MO-47AE, LCC-68
Reach Compliance Codeunknown
Maximum access time25 ns
Other featuresALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX
Spare memory width16
JESD-30 codeS-PQCC-J68
length24.2824 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX32
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Maximum seat height4.572 mm
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width24.2824 mm

WPS128K32-25PJI Related Products

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Description SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 128KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 128KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 128KX32, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction PLASTIC, MO-47AE, LCC-68 QCCJ, QCCJ, PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68
Reach Compliance Code unknown compliant compliant unknown unknown unknow unknown unknown
Maximum access time 25 ns 17 ns 20 ns 15 ns 25 ns 15 ns 12 ns 20 ns
Other features ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX
Spare memory width 16 16 16 16 16 16 16 16
JESD-30 code S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68
length 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bi 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 68 68 68 68 68 68 68 68
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C
organize 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ QCCJ QCCJ QCCJ QCCJ QCCJ QCCJ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Maximum seat height 4.572 mm 4.572 mm 4.572 mm 4.572 mm 4.572 mm 4.572 mm 4.572 mm 4.572 mm
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal form J BEND J BEND J BEND J BEND J BEND J BEND J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm 24.2824 mm
Maker Microsemi Microsemi - Microsemi Microsemi Microsemi - -
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