MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
Objectid | 105405970 |
package instruction | , SIP30(UNSPEC) |
Reach Compliance Code | unknown |
compound_id | 181492774 |
Maximum access time | 80 ns |
I/O type | COMMON |
JESD-609 code | e0 |
memory density | 9437184 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 9 |
Number of terminals | 30 |
word count | 1048576 words |
character code | 1000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX9 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
Encapsulate equivalent code | SIP30(UNSPEC) |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 512 |
Maximum standby current | 0.0018 A |
Maximum slew rate | 0.63 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal location | SINGLE |
MCM9L1000LH80 | MCM9L1000S80 | MCM9L1000AS80 | MCM9L1000L80 | MCM9L1000L70 | MCM9L1000SG80 | |
---|---|---|---|---|---|---|
Description | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC |
Maker | NXP | NXP | NXP | NXP | NXP | NXP |
package instruction | , SIP30(UNSPEC) | SIMM, SIM30 | SIMM, SIM30 | , SIP30,.2 | , SIP30,.2 | SIMM, SIM30 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow |
Maximum access time | 80 ns | 80 ns | 80 ns | 80 ns | 70 ns | 80 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
memory density | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bi | 9437184 bi |
Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
memory width | 9 | 9 | 9 | 9 | 9 | 9 |
Number of terminals | 30 | 30 | 30 | 30 | 30 | 30 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Encapsulate equivalent code | SIP30(UNSPEC) | SIM30 | SIM30 | SIP30,.2 | SIP30,.2 | SIM30 |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 512 | 512 | 512 | 512 | 512 | 512 |
Maximum standby current | 0.0018 A | 0.0018 A | 0.0018 A | 0.0018 A | 0.0018 A | 0.0018 A |
Maximum slew rate | 0.63 mA | 0.63 mA | 0.63 mA | 0.63 mA | 0.72 mA | 0.63 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |