MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC
| Parameter Name | Attribute value |
| Maker | NXP |
| package instruction | SIMM, SIM30 |
| Reach Compliance Code | unknow |
| Maximum access time | 80 ns |
| I/O type | COMMON |
| JESD-30 code | R-PSMA-N30 |
| memory density | 9437184 bi |
| Memory IC Type | FAST PAGE DRAM MODULE |
| memory width | 9 |
| Number of terminals | 30 |
| word count | 1048576 words |
| character code | 1000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX9 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SIMM |
| Encapsulate equivalent code | SIM30 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 512 |
| Maximum seat height | 20.447 mm |
| Maximum standby current | 0.0018 A |
| Maximum slew rate | 0.63 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 2.54 mm |
| Terminal location | SINGLE |
| MCM9L1000SG80 | MCM9L1000S80 | MCM9L1000AS80 | MCM9L1000L80 | MCM9L1000LH80 | MCM9L1000L70 | |
|---|---|---|---|---|---|---|
| Description | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| package instruction | SIMM, SIM30 | SIMM, SIM30 | SIMM, SIM30 | , SIP30,.2 | , SIP30(UNSPEC) | , SIP30,.2 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknow |
| Maximum access time | 80 ns | 80 ns | 80 ns | 80 ns | 80 ns | 70 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| memory density | 9437184 bi | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bi |
| Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 |
| Number of terminals | 30 | 30 | 30 | 30 | 30 | 30 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Encapsulate equivalent code | SIM30 | SIM30 | SIM30 | SIP30,.2 | SIP30(UNSPEC) | SIP30,.2 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 512 | 512 | 512 | 512 | 512 | 512 |
| Maximum standby current | 0.0018 A | 0.0018 A | 0.0018 A | 0.0018 A | 0.0018 A | 0.0018 A |
| Maximum slew rate | 0.63 mA | 0.63 mA | 0.63 mA | 0.63 mA | 0.63 mA | 0.72 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm |
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