MCM9L1000AS80 datasheet, PDF - EEWORLD Datasheet

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MCM9L1000AS80: DescriptionMEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC; Categorystorage storage; File Size836KB，12 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MCM9L1000AS80 Overview

MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC

MCM9L1000AS80 Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	SIMM, SIM30
Reach Compliance Code	unknown
Maximum access time	80 ns
I/O type	COMMON
JESD-30 code	R-PSMA-N30
memory density	9437184 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	9
Number of terminals	30
word count	1048576 words
character code	1000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX9
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SIMM
Encapsulate equivalent code	SIM30
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
Maximum seat height	20.447 mm
Maximum standby current	0.0018 A
Maximum slew rate	0.63 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	2.54 mm
Terminal location	SINGLE
Base Number Matches	1

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MCM9L1000AS80 Related Products

	MCM9L1000AS80	MCM9L1000S80	MCM9L1000L80	MCM9L1000LH80	MCM9L1000L70	MCM9L1000SG80
Description	MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIM,30PIN,PLASTIC
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	SIMM, SIM30	SIMM, SIM30	, SIP30,.2	, SIP30(UNSPEC)	, SIP30,.2	SIMM, SIM30
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow	unknow
Maximum access time	80 ns	80 ns	80 ns	80 ns	70 ns	80 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
memory density	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bi	9437184 bi
Memory IC Type	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
memory width	9	9	9	9	9	9
Number of terminals	30	30	30	30	30	30
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX9	1MX9	1MX9	1MX9	1MX9	1MX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Encapsulate equivalent code	SIM30	SIM30	SIP30,.2	SIP30(UNSPEC)	SIP30,.2	SIM30
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	512	512	512	512	512	512
Maximum standby current	0.0018 A	0.0018 A	0.0018 A	0.0018 A	0.0018 A	0.0018 A
Maximum slew rate	0.63 mA	0.63 mA	0.63 mA	0.63 mA	0.72 mA	0.63 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal location	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm

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